Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SSP9461 是上海矽朋(Siproin)推出的一款高输入电压、可调输出的降压型 DC-DC 电源芯片。器件采用同步整流、降压拓扑并集成开关晶体管,输入电压范围宽(4.5V 至 60V),输出电流可达 1.2A,工作温度覆盖工业级 -40℃ 至 +125℃,开关频率 480kHz,静态电流仅 730μA,适用于汽车、工业和通信等要求宽输入、高可靠性的场合。
(注:具体精度、效率曲线、开关损耗、负载调整率等详细指标,请参阅官方数据手册。)
SSP9461 提供 SOP-8-EP 封装,器件底部带热沉焊盘(Exposed Pad),建议在 PCB 设计中做好底盘焊盘铺铜并配合过孔导热至多层地铜层,以提升散热能力。对于 1.2A 级别输出,选用低 DCR 的外部电感并保证器件周边散热空间,可有效降低结温、提升可靠性。
器件内部集成同步整流与开关管,常见此类芯片会设计过流、短路和过温保护以提高系统鲁棒性。实际设计中建议:
品牌:Siproin(上海矽朋)
封装:SOP-8-EP
型号:SSP9461
建议在设计前获取并仔细阅读 SSP9461 的最新数据手册与应用笔记;如需样片、评估板或详细应用指导,可联系供应商或上海矽朋技术支持获取进一步资料与建议。
若需,我可以根据您的输入/输出电压、期望效率和 PCB 尺寸提供更具体的参考设计要点与外部元件选型建议。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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