WMSIC Electronic Components

Siproin SSP9461

ModelSSP9461
PackageSOP-8-EP
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Electronic Component

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP9461
Type
SIPROIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIPROIN
Electronic Component
SSP9461
Electronic Component
1
Package
SOP-8-EP
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.178g
Electronic Component
1
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0265529407
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~60V
Switching Frequency
480kHz
Electronic Component
Electronic Component
Output Voltage
810mV~57V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP9461 产品概述

一、产品简介

SSP9461 是上海矽朋(Siproin)推出的一款高输入电压、可调输出的降压型 DC-DC 电源芯片。器件采用同步整流、降压拓扑并集成开关晶体管,输入电压范围宽(4.5V 至 60V),输出电流可达 1.2A,工作温度覆盖工业级 -40℃ 至 +125℃,开关频率 480kHz,静态电流仅 730μA,适用于汽车、工业和通信等要求宽输入、高可靠性的场合。

二、主要特点

  • 宽输入电压:4.5V ~ 60V,适应汽车蓄电、工业总线及不稳定电源环境。
  • 可调输出:通过外部分压器实现输出电压调节,灵活支持多种系统电压需求。
  • 同步整流:集成同步降压结构,提高转换效率、降低外部整流损耗。
  • 内置开关管:简化外部器件数量,提升系统集成度。
  • 低静态电流:待机时静态电流约 730μA,有利于功耗受控的系统。
  • 工作电流能力:最高 1.2A 输出电流,满足中小功率负载需求。
  • 频率稳定:固定开关频率 480kHz,便于电感与滤波设计权衡体积与效率。
  • 宽温度范围:-40℃ ~ +125℃,满足工业级环境要求。
  • 封装:SOP-8-EP,带散热底盘,便于 PCB 散热设计。

三、典型电气参数与工作条件

  • 输入电压范围:4.5V ~ 60V
  • 输出类型:可调(外接电阻设定)
  • 开关频率:480kHz(固定)
  • 输出电流:最大 1.2A
  • 静态电流(Iq):约 730μA
  • 工作温度:-40℃ ~ +125℃
  • 拓扑:降压(Buck),同步整流,内置开关管

(注:具体精度、效率曲线、开关损耗、负载调整率等详细指标,请参阅官方数据手册。)

四、封装与热管理

SSP9461 提供 SOP-8-EP 封装,器件底部带热沉焊盘(Exposed Pad),建议在 PCB 设计中做好底盘焊盘铺铜并配合过孔导热至多层地铜层,以提升散热能力。对于 1.2A 级别输出,选用低 DCR 的外部电感并保证器件周边散热空间,可有效降低结温、提升可靠性。

五、保护与可靠性建议

器件内部集成同步整流与开关管,常见此类芯片会设计过流、短路和过温保护以提高系统鲁棒性。实际设计中建议:

  • 在输入侧加入适当的瞬态保护(如 TVS)以应对高压脉冲或反向瞬变;
  • 输入/输出滤波电容采用低 ESR 型号以稳定环路并抑制纹波;
  • 选择电感、电容的额定电流和电压要留余量,确保长期可靠工作。
    请以 SSP9461 数据手册中的保护特性和限制参数为准。

六、典型应用场景

  • 汽车电子(车载控制单元、传感器供电、车载辅助系统等)
  • 工业控制(传感器接口、工业总线供电、PLC 辅助电源等)
  • 通信设备(中低功率通信模块、电源管理)
  • 仪器仪表与分布式电源系统

七、设计与布局要点

  • 输入侧靠近芯片放置大容量电容,减小输入回路寄生电感;
  • 输出侧滤波电容和电感靠近芯片与负载,缩短信号回路;
  • 将底部散热焊盘充分焊接至 PCB,大面积铜箔并使用过孔连接多层内地;
  • 对于高压输入场合,增加浪涌抑制元件并注意元件间距与爬电距离设计;
  • 调整反馈分压网络时,注意分压阻值与噪声耦合,必要时并联旁路电容以提升稳定性。

八、采购与技术支持

品牌:Siproin(上海矽朋)
封装:SOP-8-EP
型号:SSP9461
建议在设计前获取并仔细阅读 SSP9461 的最新数据手册与应用笔记;如需样片、评估板或详细应用指导,可联系供应商或上海矽朋技术支持获取进一步资料与建议。

若需,我可以根据您的输入/输出电压、期望效率和 PCB 尺寸提供更具体的参考设计要点与外部元件选型建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.