Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Siproin SSP7603P33M5R
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Siproin SSP7603P33M5R
- Type
- SIPROIN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 170mV@(100mA)
- Electronic Component
- SIPROIN
- Electronic Component
- SSP7603P33M5R
- Electronic Component
- 1
- Package
- SOT-23-5
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.04g
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0219918254
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 15V
- Output
- Electronic Component
- Output Voltage
- 3.3V
- Output Current
- 500mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SSP7603P33M5R 产品概述
一、产品简介
SSP7603P33M5R是一款由上海矽朋（Siproin）制造的线性稳压器（LDO），它专为高效能电子设备设计，提供稳定的输出电压与高品质的电源管理解决方案。这款LDO采用固定15V输入，500mA输出能力，能够将输入电压稳压至3.3V，并通过5脚SOT-23封装提供出色的热管理和小尺寸的设计优势。
二、主要特点
固定输出电压：SSP7603P33M5R提供3.3V的稳定输出电压，适合许多要求低电压供电的数字及模拟电路。固定输出设计简化了电路设计，减少了外部元件的需求。
高输出电流：该元件能够支持最大500mA的负载电流，适合为多种电子设备供电，无论是手持式电子产品、传感器，还是较小的嵌入式系统，都可轻松应对。
低压差特性：作为线性稳压器，SSP7603P33M5R具备低压差特性，保证在输入电压较低的情况下，依旧能够提供所需的输出电压。这一特性极大提升了电源的使用效率，尤其是在电池供电的应用中，可以有效延长设备的使用时间。
输出电压精度：产品提供良好的输出电压稳定性，输出电压的精度高达±2%。这使得整个电子系统在各种工作环境和负载变化下，依然能够保持良好的性能，确保敏感电路的可靠运行。
小型化封装：采用SOT-23-5封装，该LDO具备小巧的外形设计，适合空间有限的电路板，有助于降低整体产品的体积和重量，提高设计的灵活性。
温度范围：SSP7603P33M5R能够在广泛的温度范围内正常工作，适应多种环境条件，保障了其在严苛条件下的可靠性。
三、应用场景
SSP7603P33M5R特别适用于以下应用场景：
消费电子：如智能手机、平板电脑、便携式媒体播放器等产品，为其供电系统提供稳定的电源。
嵌入式系统：在各种嵌入式设备（例如物联网设备、模块化控制器）中，提供必要的电压支持，确保系统的稳定性与可靠性。
传感器和仪器：为各类传感器模块和测量仪器提供稳定的工作电压，支持高准确性的测量与读取功能。
工业设备：在工业自动化设备中，如PLC、数据采集系统，通过稳定的电源供应保证系统的高效运行。
汽车电子：在汽车内部电子装置中，例如仪表盘、音响系统等，提供可靠的电源支持。
四、总结
SSP7603P33M5R线性稳压器是一个功能强大、设计灵活、易于集成的电源管理解决方案。其固定的输出电压、出色的电流能力、低压差特性以及可靠的性能，确保在各类应用中都能表现出色。无论是在消费电子、嵌入式系统，还是工业设备，SSP7603P33M5R都能为电路设计和电源需求提供理想的支持，帮助工程师们高效便捷地满足现代电子产品的设计需求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
