WMSIC Electronic Components

Siproin SSP7786A-5.0V SSP7786A

ModelSSP7786A-5.0V
PackageSOP-8
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP7786A-5.0V
Type
SIPROIN
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIPROIN
Electronic Component
SSP7786A-5.0V
Electronic Component
1
Package
SOP-8
Electronic Component
AC-DC Controllers and Regulators
Electronic Component
0.17g
Electronic Component
1
Features
(SCP); (OTP); (UVP); (OCP)
Electronic Component
BM0265617011
Operating Temperature
40℃~+85℃
Output Voltage
5V
Output Current
138mA
Transistor Voltage Rating
650V
Electronic Component
Electronic Component
Electronic Component
4000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP7786A-5.0V 线性稳压器产品概述

一、产品核心定位与应用场景

SSP7786A-5.0V是上海矽朋(Siproin)推出的高压固定输出线性稳压器,针对高压环境下的小电流稳压需求定制,核心优势是高输入耐压、集成多重保护及宽温适应性,可广泛应用于工业控制、电力监测、智能家居等对电源可靠性要求较高的场景。其输出固定为5V,最大输出电流138mA,适合为小型传感器、MCU、通信模块等低功耗负载供电,无需额外复杂的降压电路即可适配高压输入场景。

二、关键性能参数解析

1. 高压输入与输出特性

  • 输入耐压:晶体管耐压达650V,支持高电压输入场景(典型应用输入305V),可直接适配工业高压供电网络或高压辅助电源,无需额外降压预处理;
  • 输出特性:固定输出5V,输出精度满足常规低功耗负载需求,最大输出电流138mA,覆盖多数小型电子模块(如传感器、蓝牙模块)的供电电流范围;
  • 纹波抑制:典型纹波抑制比(PSRR)达60dB,可有效抑制输入电压中的纹波干扰,为负载提供纯净稳定的电源,避免噪声影响敏感电路(如模拟传感器)。

2. 宽温工作范围

工作温度覆盖**-40℃~+85℃**,符合工业级温度标准,可在低温(如北方户外设备)、高温(如设备机箱内部)环境下稳定工作,无需额外散热设计即可满足多数场景需求,降低系统设计成本。

三、集成保护功能详解

SSP7786A-5.0V集成四重核心保护功能,大幅提升产品可靠性与安全性:

  1. 过热保护(OTP):当芯片结温超过内部设定阈值(如150℃左右,具体以 datasheet 为准)时,自动关断输出,防止器件因过热烧毁;温度回落至安全范围后,自动恢复正常输出,无需人工干预。
  2. 短路保护(SCP):输出端发生短路时,内部限流电路启动,将输出电流限制在安全值内(如低于200mA),避免器件因大电流过载损坏;短路故障排除后,输出自动恢复,不影响后续使用。
  3. 欠压保护(UVP):当输入电压低于设定的欠压阈值(如低于280V)时,停止输出,防止输入电压不足导致输出电压波动,保护负载电路(如MCU)免受异常电压影响。
  4. 过流保护(OCP):输出电流超过最大允许值(如138mA以上)时,启动限流机制,将电流限制在安全区间,避免过流导致的器件老化或损坏,保障电源系统稳定。

四、封装与可靠性设计

  • 封装形式:采用SOP-8贴片封装,体积紧凑(尺寸约5.2×6.2×1.6mm),适合小型化产品设计(如传感器模块、PCB板空间有限的场景),同时SOP封装的散热性能可满足138mA输出电流的散热需求,无需额外散热片。
  • 可靠性设计:除高耐压与宽温特性外,集成的多重保护功能可应对实际应用中的异常工况(如短路、过温、欠压),减少现场故障概率,提升产品使用寿命(典型MTBF可达10万小时以上)。

五、典型应用示例

  1. 工业传感器模块:为高压供电的电流/电压传感器提供稳定5V电源,如电力系统中的电能计量传感器、工业自动化中的温度传感器;
  2. 智能家居控制器:适配高压线路附近的智能控制模块(如智能开关、安防探测器),保障低功耗MCU的稳定供电;
  3. 电力监测设备:电表、数据采集器的辅助电源,为通信模块、显示单元提供5V稳压;
  4. 小型高压设备:高压LED驱动电路的辅助电源、高压继电器控制电路的稳压模块等。

SSP7786A-5.0V凭借高压适配、多重保护及宽温特性,成为高压小电流稳压场景的高性价比选择,可有效简化系统设计并提升可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.