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Siproin SSP7603P50MR
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Siproin SSP7603P50MR
- Type
- SIPROIN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- 170mV@(100mA)
- Electronic Component
- SIPROIN
- Electronic Component
- SSP7603P50MR
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Linear Regulator(LDO)
- Electronic Component
- 0.022g
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0226279106
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 15V
- Output
- Electronic Component
- Output Voltage
- 5V
- Output Current
- 500mA
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SSP7603P50MR 产品概述
一、产品简介
SSP7603P50MR 是上海矽朋（Siproin）推出的一款固定输出线性低压差稳压器（LDO），提供稳定的 5.0V 正极输出，最大输出电流可达 500mA。器件针对低压差、高效率及系统可靠性优化，适合空间受限且对噪声和纹波有一定要求的电源前端或局部稳压场合。
二、主要特性
- 固定输出：5.0V 正输出
- 输出电流：最大 500mA
- 工作/输入电压：适用于最高输入电压 15V 的系统（具体使用条件请参照数据手册）
- 压差（Dropout）：典型 170mV @ 100mA，随负载增加而上升
- 电源纹波抑制比（PSRR）：≈40dB @ 1kHz
- 保护功能：内置过流保护，可在异常负载或短路时限制输出电流，提升系统安全性
- 工作温度范围：-40℃ ~ +85℃
- 输出通道数：单通道
- 封装：SOT-23 小型封装，适合表面贴装工艺
三、电气性能要点
SSP7603P50MR 在中等频率下具备良好的纹波抑制能力（1kHz 约 40dB），对开关电源后端及噪声敏感的模拟电路有较好抑制效果。典型压差在轻负载下极低（170mV@100mA），在要求电源头部余量较小的设计中能带来更高效率。但需注意，随输出电流增长，压差与功耗将明显增加，设计时需留足输入电压裕量并评估热耗散。
四、封装与引脚
器件采用 SOT-23 小型封装，便于空间受限的嵌入式或便携产品应用。常见三引脚排列为 IN（输入）、OUT（输出）、GND（地）；实际引脚排列与焊盘尺寸请以官方器件数据手册为准，以保证焊接可靠性与散热性能。
五、典型应用场景
- 电池供电与便携式设备的局部稳压
- 工业控制与通信模块的数字电源管理
- 传感器、MCU、外围接口电源供给
- 消费电子与物联网终端的后端稳压
六、设计与布局建议
- 输入端建议放置去耦电容（如 1µF~10µF 陶瓷），靠近 IN 引脚以抑制入端瞬态与寄生。
- 输出端建议使用低 ESR 陶瓷电容（典型 2.2µF~10µF），并尽量靠近 OUT 与 GND 引脚以保证环路稳定性与瞬态响应。
- 对于最大 500mA 工作点，应评估封装热阻并在 PCB 上提供适当铜面积或散热路径，避免长期过热导致性能退化或热关断。
- 若系统对纹波与噪声有更高要求，可在输入侧增加滤波网络或在输出侧并联 RC 滤波器，但需注意环路稳定性影响。
- 布局时将信号地与功率地合理分区，减小回流路径与噪声耦合。
七、可靠性与保护建议
器件内置过流限制，可在短路或过载条件下保护负载及自身。为了提高整机可靠性，建议加入过压、反接保护与合适保险元件；在长期高负载场景下，需考虑功耗散热与温升对性能的影响，并进行相应的热设计与器件选型验证。
如需详细引脚定义、电气特性曲线、典型应用电路和推荐 PCB 焊盘，请参阅 SSP7603P50MR 的产品数据手册或联系上海矽朋官方技术支持。
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