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Siproin SSP61CC4202MR
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Siproin SSP61CC4202MR
- Type
- SIPROIN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SIPROIN
- Electronic Component
- SSP61CC4202MR
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- Supervisorand positions IC
- Electronic Component
- 0.12g
- Electronic Component
- 1
- Electronic Component
- BM0228540495
- Operating Voltage
- 700mV~10V
- ICType
- Voltage Detector
- Output Type
- Electronic Component
- Voltage
- 4.2V
- Static Current(Iq)
- 1.1uA
- Supervisor Voltage
- 1
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SSP61CC4202MR 产品概述
一、概述
SSP61CC4202MR 是上海矽朋（Siproin）推出的一款单路电压监控与复位（voltage detector / reset）芯片，采用 SOT-23 小封装，适用于电池供电与低功耗系统的电源监测与复位管理。器件工作温度范围为 -30℃ 至 +80℃，设计用于在微控制器和数字系统上提供可靠的上电复位与欠压检测功能。
二、主要参数
- 输出类型：推挽（Push‑Pull），可直接驱动上拉或下拉负载
- 静态电流（Iq）：典型 1.1 μA，适合低功耗应用
- 阈值电压（Vth）：4.2 V（监测点阈值）
- 工作电压范围：0.7 V ～ 10 V（供电范围）
- 受监控电压点：1 路
- 工作温度：-30℃ ～ +80℃
- 封装：SOT-23（3 引脚小封装）
三、功能说明
器件对单一路电源/监测点进行阈值比较，当被监控电压低于 4.2V 时，复位输出保持在复位态；当电压回升并超过阈值（加上内部迟滞）后，输出释放。推挽输出结构兼具源/汲能力，可减少外部上拉电阻需求并提高驱动能力。超低静态电流保证在待机与断续工作模式下对系统功耗影响极小。
四、典型应用场景
- 单片机/MCU 的电源复位与上电复位（POR）
- 电池供电设备、电源管理与电量监测
- 便携式与物联网终端的低功耗监控电路
- 电源序列控制与系统可靠性保护
五、封装与引脚（参考）
SOT-23 三引脚封装，常见引脚功能（仅供参考，详见厂商数据手册）：
- 引脚1：RESET（复位输出）
- 引脚2：GND（地）
- 引脚3：VDD（被监控电源 / 供电）
实际引脚功能与封装请以制造商资料为准。
六、设计与使用建议
- 在 VDD 侧并联 0.1 μF 陶瓷电容进行去耦，减少瞬态噪声对检测精度的影响。
- 对于对复位时序敏感的系统，可在 RESET 与地之间并联小电容，延长复位释放后的上升时间（注意可能影响复位延时）。
- 评估阈值余量（margin）以应对温度、制造差异与电源纹波；在临界工作点处建议增加适当容差。
- 推挽输出无需外部上拉即可直接驱动多数负载，但若与开集电极输入接口连接，请注意电平兼容性。
- 在高 EMC/噪声环境下，合理布局走线并靠近电源引脚放置旁路电容，避免误触发。
七、采购与资料
产品型号：SSP61CC4202MR，品牌：Siproin（上海矽朋），封装：SOT-23。为获得完整电气参数（如阈值公差、内部迟滞、复位延时、绝对最大额定值及典型应用电路），建议参考 Siproin 官方数据手册与样片测试报告，或联系厂商技术支持获取最新规格与可靠性认证信息。
注：本文为基于给定参数的产品概述，具体设计与验证请以制造商正式数据手册为准。
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