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Siproin SSP5840ED
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- Siproin SSP5840ED
- Type
- SIPROIN
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SIPROIN
- Electronic Component
- SSP5840ED
- Electronic Component
- 1
- Package
- SOIC-16-300mil
- Electronic Component
- Isolated
- Electronic Component
- 0.61g
- Electronic Component
- 1
- CMTI(kV/us)
- 50kV/us
- Features
- Output
- Electronic Component
- BM0226460858
- Operating Temperature
- 40℃~+125℃
- Output
- Level
- Channel Count
- 0
- Channel Count
- 4
- (tpd)
- 9ns
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SSP5840ED 产品概述
SSP5840ED 是 Siproin（上海矽朋）推出的一款 4 通道数字隔离器，采用芯片级高压隔离工艺，面向工业控制、驱动隔离、传感器接口和高速数字信号隔离等应用。器件在保证 5kVrms 隔离等级的同时，实现低辐射、优异抗电磁干扰性能和低功耗运行，适合对可靠性和抗干扰性要求较高的系统。
一、主要特性
- 通道数：4 个正向通道（单向），无反向通道。
- 最大数据速率：150 Mbps，满足多数高速数字接口需求。
- 失效安全输出：在输入电源或输入信号异常（如失电）时，输出可恢复到默认状态（默认高电平），提高系统安全性。
- 默认输出：高电平。
- 隔离电压：5000 Vrms（器件隔离等级）。
- CMTI（共模瞬变抗扰度）：50 kV/μs，适用于电机驱动、电源转换等高速共模干扰场景。
- 传播延迟（tpd）：约 9 ns，提供良好的定时特性，便于高频同步与时序控制。
- 电源范围：VCCA、VCCB 均支持 2.5V ~ 5.5V，便于与不同逻辑电平系统对接。
- 工作温度：-40 ℃ ~ +125 ℃，满足工业级温度要求。
- 封装：SOIC-16（300 mil）。
- 使能与高阻抗：带使能引脚，可将输出置为高阻抗状态，便于总线共享或故障隔离。
二、典型应用场景
- 工业控制总线隔离（SPI、UART 单向线路、控制信号等）。
- 电机驱动与逆变器控制板，利用高 CMTI 抵抗快速共模瞬变。
- 隔离传感器采集与信号回传（单向信号链路）。
- 隔离微控制器与高压侧逻辑或测量前端，提升人员与设备安全。
- 医疗、能源与电力电子中的安全隔离信号传输（需配合系统评估）。
三、设计与应用建议
- 两侧电源（VCCA、VCCB）分别近端放置去耦电容（如 0.1 μF 与 1 μF 组合），以抑制电源噪声并保证器件瞬态响应。
- 保持隔离区的爬电距离和间隙，符合系统所需的安全规范与工艺要求。
- 对于高共模瞬变环境，建议在 PCB 布局中优化接地回路和布设分割地，以降低对低压侧的影响。
- 使用使能引脚管理总线占用与电源上电顺序，结合失效安全特性，提高系统健壮性。
- 注意信号线终端匹配与阻抗控制，避免在接近 150 Mbps 时出现反射或信号完整性问题。
四、封装与可靠性
SSP5840ED 提供 SOIC-16（300 mil）封装，适合常见的贴装与波峰/回流焊工艺。器件工作温度范围 -40 ℃~+125 ℃，在工业级环境下具有良好可靠性和长期稳定性。
总结：SSP5840ED 将高隔离电压、强抗扰度与较高数据速率结合，适配多种需单向数字隔离的工业与电力电子应用。设计时注意电源去耦、隔离区布局及信号完整性，即可发挥其低功耗、低辐射与失效安全等优势。若需完整数据手册或引脚排列图，请联系 Siproin 或其授权代理获取详细规格与应用电路。
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