WMSIC Electronic Components

Siproin SSP1837

ModelSSP1837
PackageSOP-8
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP1837
Type
SIPROIN
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIPROIN
Electronic Component
SSP1837
Electronic Component
1
Package
SOP-8
Electronic Component
Energy Metering IC
Electronic Component
0.3%
Electronic Component
0.049g
Electronic Component
1
Channel Count
2
Features
Built-in Reference;; Output
Dynamic
2500:1
Electronic Component
BM0226460845
Operating Temperature
40℃~+85℃
Operating Voltage
3V~3.6V
Operating Current
3mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP1837 产品概述

一、产品简介

SSP1837 是 Siproin(上海矽朋)推出的一款高精度单相电能计量芯片,采用 SOP-8 封装,面向智能电表、模块化计量设备及嵌入式能耗监测等场景。芯片集成了高精度能量计量核心、两通道电压/电流采样路径与低功耗基准源,适用于对计量准确性和长期稳定性要求较高的应用。

二、主要特性

  • 时钟频率(fc):2 MHz,保证高速处理与良好时间分辨率。
  • 动态范围:2500:1,支持大动态范围负载测量。
  • 精度:0.3%,满足国家计量与商业计费级别要求。
  • 通道数:2 路,可同时采集电压与电流或两相信号的差分测量。
  • 工作电压:3.0 V ~ 3.6 V,适配常见单电池与稳压供电方案。
  • 工作电流:典型 3 mA,利于系统低功耗设计。
  • 基准电压:内部基准 1.218 V,提供高稳定性的测量基准。
  • 工作温度:-40 ℃ ~ +85 ℃,满足工业级环境要求。

三、典型功能与应用

SSP1837 提供精确的有功电能计量与功率测量功能,支持脉冲/寄存器输出用于上位机或 MCU 读取。适用于:

  • 智能单相电能表、预付费表;
  • 家电能耗监测模块;
  • 远程抄表与工业用电监控。
    其低功耗与宽温度范围,利于户外或电网侧安装的长期可靠运行。

四、设计与使用注意事项

  • 采样通路与参考地(GND)需做好布局与去耦,降低共模噪声对精度的影响;
  • 输入信号防护与滤波:建议在电压、电流采样端加入抗别和低通滤波器以抑制谐波和瞬态;
  • 供电稳定性:尽量使用低噪声 LDO,并对 1.218 V 基准进行良好旁路;
  • 校准与温漂补偿:结合温度系数进行一次性标定,可进一步提升长期计量精度。

五、封装与支持

SSP1837 提供 SOP-8 封装,利于自动贴片生产与散热。上海矽朋提供应用手册与参考电路,便于快速集成到计量系统中。

综上,SSP1837 以高精度、宽动态、低功耗与工业级温度特性,为单相电能计量与能耗监测提供了可靠的芯片级解决方案。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.