WMSIC Electronic Components

Siproin SSP8099-33YT SSP8099

ModelSSP8099-33YT
PackageTDFN-6AL(2x2)
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP8099-33YT
Type
SIPROIN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIPROIN
Electronic Component
SSP8099-33YT
Electronic Component
1
Package
TDFN-6AL(2x2)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.035g
Electronic Component
1
Features
Output Voltage; Load
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0227783269
Operating Temperature
40℃~+85℃@(TA)
Operating Voltage
900mV~5.2V
Switching Frequency
1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP8099-33YT 产品概述

SSP8099-33YT 是上海矽朋(Siproin)推出的一款升压型 DC-DC 转换器,专为空间受限且对待机功耗和启动电压要求严格的电池供电设备设计。器件集成式开关场效应管、同步整流并采用固定 3.3V 输出,具备低静态电流(Iq = 1μA)与高开关频率(1MHz),可在 900mV 至 5.2V 的输入电压范围内稳定输出最高 300mA 电流,封装为紧凑的 TDFN-6AL (2 × 2 mm)。

一、主要特点

  • 输入电压范围:900mV ~ 5.2V,支持非常低电压启动与工作,适合单节耗尽电池或低电压电源场景。
  • 固定输出:3.3V 输出,便于对上游外围电路进行标准化设计与快速开发。
  • 输出电流:最大可提供 300mA 连续输出,适合 MCU、传感器与低功耗无线模块供电。
  • 开关频率:1MHz,高频开关允许使用小型电感和电容,有利于缩小外部组件体积与整体 BOM。
  • 同步整流:内部同步整流结构提升转换效率、降低损耗,尤其在轻载或低输入电压时优势明显。
  • 内置开关管:无需外置 MOSFET,简化电路设计与 PCB 布局。
  • 极低静态电流:Iq = 1μA,便于延长电池寿命,适合长待机/睡眠场景。
  • 工作温度范围:-40℃ ~ +85℃(TA),满足工业级与商用级常见应用环境。
  • 封装:TDFN-6AL (2×2 mm),体积小,利于便携设备和紧密布局。

二、适用场景

  • 便携式设备:可为手持终端、便携式仪表、便携式传感器等提供稳定 3.3V 电源。
  • 物联网与无线节点:为 BLE、Zigbee、LoRa 等低功耗无线模块供电,延长电池寿命。
  • 电池驱动的传感器:在单节电池电压下降时仍能保证系统工作,适用于长期部署的传感网络。
  • 能量采集与备用电源场景:输入可能较低或不稳定时仍能提供稳定 3.3V 输出。

三、设计与选型建议

  • 输入电容与输出电容:建议使用低 ESR 的陶瓷电容以降低输出纹波并提升瞬态响应。高频(1MHz)工作使得容值不必太大,但应结合负载动态选择合适的容值以保证稳定性。
  • 电感选型:由于 1MHz 工作频率,可选择体积小的功率电感(例如数 μH 级别),但注意电感的电流承载(Isat)与 DCR,以降低发热与额外损耗。
  • PCB 布局:将 SW 引脚与电感、输入/输出电容尽量靠近,缩短高电流回路路径;为地平面提供良好回流,器件底部焊盘用于散热;避免长串联走线以减少 EMI。
  • 热管理:TDFN-6 小封装对散热有限,在接近 300mA 输出或高输入电压差工作时需关注结温(Tj),必要时通过铜箔/散热孔提高散热能力或降低持续负载。
  • 负载能力与电源预算:300mA 为器件额定输出,需考虑系统峰值电流、启动浪涌及效率变化对电池电压的影响,在设计电源预算时留有裕量。

四、性能要点与工程注意事项

  • 启动与稳态:900mV 的低启动电压允许设备在电池接近耗尽时仍能点亮,但实际可用输出功率会随输入电压降低而下降,应在系统层面验证低压下的启动可靠性。
  • 效率表现:同步整流在中高负载下能够显著提升效率、降低发热;在轻载情况下低静态电流优势明显,可有效降低待机功耗。
  • EMI 与滤波:1MHz 的开关频率相对较高,合理的布局与滤波元件选择可控制电磁干扰,需按系统 EMI 要求配置输入滤波与布局保护。

五、封装与配套信息

  • 封装型号:TDFN-6AL (2×2 mm),适合体积受限的应用。
  • 封装优势:小尺寸、适合自动贴装,同时器件底部焊盘利于散热和可靠焊接工艺。
  • 典型外部器件:外接小尺寸功率电感、输入/输出陶瓷电容及必要的 PCB 走线即可构成完整升压电源方案,系统集成度高,便于批量生产。

总结:SSP8099-33YT 以其超低静态电流、低启动电压和内置同步开关的设计,适合对尺寸、功耗和低电压启动有严格要求的便携与物联网终端。采用 1MHz 开关频率与 2×2mm 紧凑 TDFN 封装,在保证 3.3V、300mA 输出能力的同时,便于实现小体积、高能效的电源解决方案。在实际应用前建议结合目标负载与热环境完成基板布局与外部元件的评估与验证。

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