WMSIC Electronic Components

Siproin SSP7903P36JR

ModelSSP7903P36JR
PackageTO-252
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 23+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin SSP7903P36JR
Type
SIPROIN
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
1.5V@(1A)
Electronic Component
SIPROIN
Electronic Component
SSP7903P36JR
Electronic Component
1
Package
TO-252
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.5g
Electronic Component
1
Electronic Component
BM0227783253
Operating Temperature
40℃~+85℃@(Ta)
Operating Voltage
40V
Output
Electronic Component
Output Voltage
3.6V
Output Current
1A
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SSP7903P36JR 产品概述

SSP7903P36JR 是上海矽朋(Siproin)推出的一款高耐压固定输出线性稳压器(LDO),输入电压最高可达 40V,固定输出 3.6V,最大输出电流 1A。器件采用 TO-252(DPAK)封装,集成过热保护、过流保护和短路保护,适合在单通道、正极输出的场合为敏感负载提供低噪声、稳定的电源。

一、主要性能参数

  • 输出类型:固定(3.6V)
  • 工作电压(最大):40V
  • 输出电流:1A(最大)
  • 压差(Dropout):1.5V @ 1A
  • 静态电流(Iq):典型 2μA
  • 电源纹波抑制比(PSRR):54.5dB @ 1kHz
  • 保护功能:过热保护(OTP)、过流保护(OCP)、短路保护
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 输出极性:正极
  • 输出通道数:1
  • 封装:TO-252(DPAK)

二、主要特性与优势

  • 高输入耐压:最大 40V 输入使其可在较高电压源(如某些工业或汽车电源场合)下工作。
  • 低静态电流:2μA 的静态电流适合对待机功耗敏感的系统。
  • 良好的纹波抑制:在 1kHz 频率处 PSRR 达 54.5dB,有利于抑制开关电源或噪声源引入的干扰。
  • 完善的保护机制:内置 OTP/OCP/短路保护,提高系统可靠性并简化外围保护电路设计。
  • TO-252 封装利于 PCB 安装与散热扩展,适合批量组装与自动化生产。

三、典型应用场景

  • 工业控制与仪表:高输入电压供电环境下为低压模拟/数字电路供电。
  • 通信与基站设备:为敏感前端或控制逻辑提供稳定电源(需根据环境与认证要求评估)。
  • 电池管理与电源模块:在有较大电压差时作为参考或辅助稳压(注意功耗管理)。
  • 消费电子与嵌入式系统:对功耗与噪声有较高要求的单通道供电场合。

四、设计与使用建议

  • 输出电容:为保证稳压器稳定与瞬态响应,建议在输出端使用低 ESR 电容(典型 10μF ~ 100μF,陶瓷或固态电容),并靠近器件放置。
  • 输入电容:为了抑制输入瞬态与提高稳定性,推荐在输入端放置 1μF ~ 10μF 的陶瓷电容,并增加适当的旁路电容。
  • 散热考虑:当 Vin 与 Vout 电压差较大时(例如接近 40V 输入且输出 3.6V、1A 负载),器件功耗会很高(P = (Vin − Vout) × I),需通过大面积铜箔、散热垫或外部散热器来管理结温;在高压差/高电流条件下,建议评估使用开关降压方案以降低总功耗。
  • PCB 布局:将输入/输出电容尽可能靠近器件引脚,地线采用低阻抗回流路径;在 TO-252 底部设置足够的焊盘和多层铜箔散热过孔以提升散热能力。
  • 保护与滤波:尽管器件集成多种保护,仍建议在系统层面考虑输入浪涌保护、反向保护以及必要的 EMI 滤波。

五、注意事项与选择建议

  • 评估输入电压与功耗:高压差下的线性稳压器会产生大量热量,若系统常态工作在高 Vin 与大电流条件,应优先考虑开关降压 + LDO 组合或直接采用开关稳压以提高效率。
  • 查询完整数据手册:实际设计中请参考 SSP7903P36JR 的完整数据手册以获取详细电气特性、典型曲线和稳定性测试条件(输出电容 ESR 范围、热阻参数等)。
  • 环境与认证:如用于汽车或特定工业应用,请确认器件的资格认证及额外的环境耐受性要求。

SSP7903P36JR 在高输入电压容忍、低静态电流与多重保护方面具有明显优势,适用于对低噪声与可靠性有要求但输入输出电压差受控的单通道稳压场合。对于高压差、大功率输出的应用,务必重视散热与效率评价。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.