WMSIC Electronic Components

Siproin H7533-1 H7533

ModelH7533-1
PackageTO-92-3
BrandSIPROIN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 24+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
Siproin H7533-1
Type
SIPROIN
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
50mV@(1mA)
Electronic Component
SIPROIN
Electronic Component
H7533-1
Electronic Component
1
Package
TO-92-3
Electronic Component
Linear Regulator(LDO)
Electronic Component
0.08g
Electronic Component
1
Electronic Component
BM0226460842
Operating Temperature
40℃~+85℃
Operating Voltage
15V
Output
Electronic Component
Output Voltage
3.3V
Output Current
150mA
Output Type
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

H7533-1 — 固定输出线性稳压器(3.3V)

一、简介与主要特性

H7533-1 是上海矽朋(Siproin)推出的一款低静态电流、低压差、固定输出正极线性稳压器。针对电池供电与低功耗嵌入式系统优化,适合在-40℃~+85℃工况下长期工作。主要特性包括:

  • 输出电压:3.3V(固定型)
  • 最大工作电压(输入):15V
  • 最大输出电流:150mA
  • 静态电流(Iq):1.5µA(典型)
  • 低压差:50mV @ 1mA(低电流时表现优异)
  • 输出极性:正极
  • 工作温度范围:-40℃ ~ +85℃(Ta)
  • 封装:TO-92-3(通孔三引脚)

二、主要电气参数(要点)

  • 输出电压精度与温漂:参照产品规格书中的静态与温度校准数据(典型应用中可满足常见MCU与传感器供电要求)。
  • 负载与线性调整率:在轻载至中等负载下保持稳定;注意负载电流增大时压差与功耗显著上升。
  • 保护特性:请参阅数据手册确认过流/过热保护等具体实现。

三、封装与热管理建议

H7533-1 提供 TO-92-3 通孔封装,便于快速打样与手工焊接。需注意:

  • 热耗散计算示例:当输入为15V且输出3.3V、负载150mA时,稳压器功耗约为 (15-3.3)×0.15 ≈ 1.76W,此功耗对TO-92封装热阻要求很高,长期工作可能触及温度极限。
  • 建议:在高输入电压或高电流工况下增加散热铜箔、换用散热更好的封装或采用降压预稳压器以降低器件温升;设计时务必根据实际PCB面积与环境温度评估结温。

四、典型外部元件与接线建议

  • 输入旁路电容:建议在稳压器输入端并联 0.1µF 陶瓷以滤除高频噪声,必要时增加 1µF~10µF 电解/陶瓷电容改善瞬态响应。
  • 输出电容:为保证稳定性与瞬态性能,推荐 1µF~10µF 低ESR 陶瓷电容;不同厂家的稳定区间有所差异,请以规格书为准。
  • 布线原则:输入输出走线尽量短且粗,输入地与输出地应共地回流,靠近器件放置去耦电容。
  • 引脚定义与详细电路:TO-92 引脚排列请参考官方数据手册以避免接错。

五、典型应用场景

  • 电池供电的便携式设备与传感节点(低静态电流优势)
  • 低功耗物联网终端、MCU 供电
  • 工业与消费类电子的小功率电源模块
  • 原型开发与教学实验板(TO-92 通孔便于焊装)

六、选型与注意事项

  • 在选用 H7533-1 时,请综合评估输入电压范围与最大输出电流对功耗与结温的影响。若工作环境温度偏高或需长期满载,建议增加散热措施或选择更高功率封装的型号。
  • 出货与信息:品牌为 Siproin(上海矽朋),型号 H7533-1,封装 TO-92-3。欲获取完整电气特性、引脚定义与波形图,请下载官方数据手册或联系销售工程师以获得样片与技术支持。

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