WMSIC Electronic Components

SEMTECH TS30042-M050QFNR TS30042

ModelTS30042-M050QFNR
PackageWQFN-16-EP(3x3)
BrandSEMTECH
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 22+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SEMTECH TS30042-M050QFNR
Type
SEMTECH
Minimum package
3300 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SEMTECH
Electronic Component
TS30042-M050QFNR
Electronic Component
1
Package
WQFN-16-EP(3x3)
Electronic Component
DC-DC Power Supply IC
Electronic Component
0.118g
Electronic Component
1
Features
Frequency Synchronous
Type
Electronic Component
Synchronous
Electronic Component
Electronic Component
BM0257364856
Operating Temperature
40℃~+125℃
Operating Voltage
4.5V~40V
Switching Frequency
900kHz~1.1MHz
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TS30042-M050QFNR 产品概述

一、概述

TS30042-M050QFNR 是 SEMTECH 提供的一款降压型开关稳压器(同步整流、固定输出),采用 WQFN-16-EP (3×3 mm) 封装并带裸露焊盘,面向需要稳定 5.0V 输出且输入电压范围宽的应用场景。器件内置开关管,单输出通道,最高输出电流可达 2A,开关频率为 900kHz~1.1MHz,静态工作电流仅 3.6mA,工作温度范围为 -40℃~+125℃。

二、主要特性

  • 功能类型:降压(Buck)型、固定输出 5.0V
  • 输入电压范围:4.5V ~ 40V,适应宽输入电压系统
  • 最大输出电流:2A(持续)
  • 开关频率:900kHz ~ 1.1MHz,高频有利于减少电感与电容体积
  • 同步整流:支持(无需外部肖特基)
  • 内置开关管:减小外部元件数、简化布局
  • 静态电流 Iq:3.6mA(低功耗)
  • 工作温度:-40℃ ~ +125℃
  • 封装:WQFN-16-EP (3×3 mm),带裸露焊盘,利于散热

三、应用场景

适用于工业控制、电信设备、嵌入式系统、电源模块与其它需从较宽输入获得稳定 5V/2A 电源的场合。高开关频率和小封装使其也适合空间受限且对 EMI 管理有要求的设计。

四、典型设计与布局建议

  • 输入电容:靠近 VIN 引脚放置低 ESR 陶瓷电容,抑制开关尖峰与纹波。
  • 输出电感与电容:选型以保证输出纹波与瞬态响应,建议按最大输出电流与所需纹波电流(20%~40% Iout)计算电感值;低 ESR 输出电容有助于稳定与低纹波。
  • 旁路与布局:尽量缩短高电流回路(VIN,开关节点,输出)的走线,输入电容至器件的引脚距离应最短以降低 EMI。
  • 裸露焊盘散热:在 PCB 下方添加多通孔热 vias 与大铜箔,增强散热性能并降低结温。
  • 同步整流注意:器件为同步结构,一般无需外接肖特基二极管;但在轻载或异常工况下注意电流回流路径与安全保护设计。

五、可靠性与封装注意

WQFN-16-EP 封装需注意焊盘焊接工艺与回流温度曲线,暴露焊盘需与 PCB 地平面良好焊接并配置散热过孔以满足 -40℃~+125℃ 的工作温度要求。建议参照 SEMTECH 的 PCB 推荐焊盘与回流规范以获得最佳热性能与机械可靠性。

六、设计小结

TS30042-M050QFNR 提供了宽输入、低静态电流、高开关频率与同步整流等优势,适合体积受限且需高效率 5V/2A 输出的电源设计。合理选择电感、电容并优化 PCB 布局与裸露焊盘散热,可在保证稳定性的前提下实现高能效与良好热管理。若需更详细的电气特性表、引脚定义或参考电路,请参阅厂商数据手册。

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