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SUPSiC GAQY212G2S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQY212G2S
- Type
- SUPSIC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQY212G2S
- Electronic Component
- 1
- Package
- SOP-4
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.343g
- Electronic Component
- 1
- Electronic Component
- BM0225219122
- Resistor
- 68mΩ
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 60V
- Type
- AC,DC
- (Pd)
- 450mW
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQY212G2S 产品概述
一、产品简介
GAQY212G2S 是 SUPSiC（国晶微半导体）推出的一款小封装光电隔离开关器件，封装为 SOP-4，触点形式为 1 Form A（SPST-NO）。器件面向需要电气隔离与低电阻导通的场合，支持 AC/DC 输入并具有 1.5kVrms 的隔离能力，适用于工业控制、通信及电源管理等应用。
二、主要电气参数与特性
- 隔离电压（Vrms）：1.5kV
- 触点形式：SPST-NO（1 Form A）
- 最大负载电压：60V
- 连续负载电流：1.8A
- 导通电阻：68mΩ（典型）
- 输入正向电压 Vf：1.2V（典型）
- 输入正向电流 If（激励电流）：7mA（典型）
- 总功耗 Pd：450mW
- 工作温度范围：-40℃ ~ +85℃
- 导通时间 Ton：1ms；截止时间 Toff：600µs
- 输入类型：支持 AC 与 DC 驱动
三、性能亮点
- 低导通阻抗（68mΩ），在最大额定电流下热耗相对较低（I^2R 约 [email protected]），便于在小体积封装中实现高效开关。
- 支持 AC/ DC 输入，输入端对交流信号兼容，便于直接与交流控制信号配合使用（具体接法见下）。
- 宽温度范围与较高隔离电压，适合一般工业环境的功能隔离需求。
四、典型应用场景
- 工业控制与 PLC 的信号隔离与负载驱动
- 通信设备中的继电与保护电路
- 低压直流开关、固态继电器子模块
- 电源管理、负载切换与电池保护
五、设计与使用建议
- 输入驱动：按典型 If=7mA 与 Vf=1.2V 计算串联限流电阻。例如在 5V 驱动下，Rs ≈ (5V-1.2V)/7mA ≈ 540Ω，可取 560Ω；12V 驱动下 Rs ≈ 1.5kΩ。若用于 AC 输入，请按器件说明确认是否需加整流或并联反向保护元件。
- 热设计：器件总功耗限值为 450mW，连续导通时需结合 I^2R 损耗和环境温度进行热平衡计算，高环境温度下应降额使用或加强散热。SOP-4 封装散热依赖 PCB 铜箔与过孔，推荐在焊盘区域增加铜量。
- 开关频率：Ton≈1ms、Toff≈600µs，适合低频控制与开/关场合，不建议用于高频 PWM（数十 kHz 以上）的开关应用。
- 保护措施：驱动感性负载时应在外部并联合适的箝位或吸收电路以抑制反向过压，确保器件长期可靠。
- 布局注意：保持输入与输出端之间足够的爬电距离和绝缘，遵循 1.5kVrms 隔离等级的 PCB 设计规范。
六、封装与可靠性
SOP-4 小封装便于表面贴装与高密度 PCB 布局，适用于空间受限的模块化设计。工作温度范围宽，适合一般工业环境。建议在可靠性关键应用中进行热循环与耐压测试以验证设计。
总结：GAQY212G2S 提供了在小体积下较低导通阻抗与基本工业级隔离的开关解决方案，适合多种低压负载开关与隔离场合。在电源、电流与热管理上合理设计，可发挥其高效、可靠的特点。
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