Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SUPSiC GAQY221R2S
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQY221R2S
- Type
- SUPSIC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQY221R2S
- Electronic Component
- 1
- Package
- SOP-4-175mil-2.54mm
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.386g
- Electronic Component
- 1
- Electronic Component
- BM0226465250
- Resistor
- 3.3Ω
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 60V
- Type
- AC,DC
- (Pd)
- 500mW
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQY221R2S 产品概述
一、产品简介
GAQY221R2S 是国晶微半导体（SUPSiC）推出的一款小封装固态继电器/光耦输出器件，采用 SPST-NO（1 Form A）触点形式，输入支持 AC 与 DC。器件面向工业控制、通信端口隔离、信号切换与微功率负载保护等场景，强调高隔离、低导通阻抗与快速响应。
二、主要性能参数
- 隔离电压（Vrms）：2.5 kV
- 触点形式：SPST-NO（1 Form A）
- 输入正向压降（Vf）：1.2 V（If = 标称）
- 输入正向电流（If）：50 mA（最大驱动电流）
- 总功耗（Pd）：500 mW
- 连续负载电流：250 mA
- 导通电阻（Rds(on)）：3.3 Ω
- 负载电压：60 V（最大）
- 导通/截止时间（Ton/Toff）：30 μs / 30 μs
- 工作温度范围：-40 ℃ ~ +85 ℃
- 封装：SOP-4, 175 mil, 2.54 mm 引距
三、优势特点
- 安全隔离：2.5 kV RMS 隔离等级，可满足多数信号与电源隔离需求。
- 低导通阻抗与中等负载能力：3.3 Ω 导通电阻与 250 mA 连续载流使其适合控制小功率开关和接口电路。
- 统一输入兼容性：支持 AC 与 DC 输入，正向压降仅 1.2 V，驱动简便。
- 快速响应：30 μs 的开断时间适合多数开关频率或快速切换应用。
- 工业温度等级：-40 ℃ 至 +85 ℃ 满足工业环境可靠性要求。
四、典型应用场景
- 工业控制信号隔离与继电器替代
- 低功率通信端口和传感器信号开关
- 板级电源路径选择、测试测量仪器开关阵列
- 需要电气隔离且开关速度较快的场合
五、封装与系统集成
SOP-4（175 mil）封装，2.54 mm 引脚间距，便于插装与自动贴装。器件总功耗 500 mW，PCB 布局时应注意热流散路径与周边铜箔面积；参考数据手册进行焊盘与散热设计。
六、使用建议
- 确保负载电流不超过 250 mA 且负载电压 ≤ 60 V；对感性负载建议并联 TVS 或 RC 抑制网络以吸收瞬态。
- 驱动端以不超过 50 mA 的限流方式供电，避免长期过流导致输入发热。
- 对高频开关场合注意器件的开关损耗与总功耗（Pd = 500 mW），必要时进行散热与热仿真评估。
- 在有较高绝缘要求的系统中，结合系统爬电/气隙设计以满足安全认证需求。
如需原理图参考、典型应用电路或更详细的电气特性曲线与封装尺寸图，请提供需求，我可以为您准备进一步资料。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
