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SUPSiC GAQY225G2EH
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQY225G2EH
- Type
- SUPSIC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQY225G2EH
- Electronic Component
- 1
- Package
- SMD-4P
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.293g
- Electronic Component
- 1
- Electronic Component
- BM0257658497
- Resistor
- 110mΩ
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 150V
- Type
- AC,DC
- (Pd)
- 400mW
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQY225G2EH 产品概述
一、产品简介
GAQY225G2EH 是 SUPSiC（国晶微半导体）推出的一款小型SMD固态开关器件，采用 SMD-4P 封装，触点形式为 1A（单刀单掷——常开）。器件集成高隔离输入与低导通电阻输出，适用于要求电气隔离、体积小、可靠性高的开关控制场景。
二、主要技术参数
- 触点形式：1A（单刀单掷，常开）
- 连续负载电流：2 A
- 负载电压（最大）：150 V
- 输入正向压降 Vf：1.2 V（典型）
- 触发/正向电流 If：7 mA（典型）
- 导通电阻：110 mΩ（典型）
- 隔离电压 Vrms：5 kV
- 导通时间 Ton：200 μs；截止时间 Toff：80 μs
- 输入类型：支持 AC / DC 驱动
- 工作温度范围：-40 ℃ ～ +85 ℃
- 最大总功耗 Pd：400 mW
- 封装：SMD-4P
三、产品特点
- 高隔离性：5 kV 的工频隔离能够满足多数工业与民用控制端与功率端之间的安全隔离要求。
- 低导通损耗：110 mΩ 的导通电阻配合 2 A 连续载流能力，能在较低功耗下完成开关功能。
- 宽输入兼容：支持 AC 与 DC 输入驱动，输入端典型正向电流 7 mA，驱动接口灵活。
- 中等开关速度：Ton 约 200 μs、Toff 80 μs，适合一般控制与信号隔离应用，但不用于高频开关场合。
- 宽温度范围与 SMD 小型封装，便于自动化贴装与体积受限的电子产品集成。
四、典型应用场景
- 工业控制与自动化开关信号隔离
- 仪器仪表、小功率电源切换
- 家电控制模块、楼宇自控
- 通讯与安防设备中需要隔离的开/关控制
五、使用建议与注意事项
- 驱动电流：建议保证输入端正向电流不低于典型 If=7 mA 以确保可靠导通，必要时按器件数据表留有裕度。
- 热管理：器件最大功耗 Pd=400 mW，持续 2 A 负载下需考虑导通损耗产生的温升并进行热设计与散热路径规划。
- 负载类型：对感性负载（电机、继电器线圈等）建议外接抑制回路（RC 抑制器或续流二极管）以抑制浪涌与过压。
- 开关频率：基于 Ton/Toff 特性，该器件适用于低频或事件驱动的开关场合，不推荐用于高频 PWM 开关。
- 工作环境：请在规定的工作温度范围内使用，并遵循制造商的 PCB 布局及焊接工艺指南以保证长期可靠性。
六、封装与可靠性
SMD-4P 表面贴装封装有利于自动化生产与小型化设计，器件通过工业级温度循环与绝缘强度设计，适合严苛环境下长期运行。具体的引脚排列与 PCB 推荐封装尺寸请参照官方数据手册以获得最优电气与热性能。
如需更详细的电气特性曲线、典型应用电路或 PCB 封装信息，请参考 SUPSiC 官方数据手册或咨询厂商技术支持。
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