Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQY214DEH(品牌:SUPSiC / 国晶微半导体)是一款SMD-4P 封装的固态光耦/光电继电器类器件,采用单刀单掷常开(1A,Form A)触点形式,适用于对高压但低电流回路进行隔离开关控制。器件输入支持交流与直流驱动,输出端可承受高达400V的负载电压,设计上兼顾体积小、无机械触点、寿命长与电气隔离性能。
说明:上述参数为典型/标称值,实际设计应以完整规格书中的极限值与热性能为准并留有裕量。
SMD-4P 小型表贴封装便于自动化生产、节省PCB 空间。器件无机械触点、无接触磨损,理论寿命远长于机械继电器,但需注意输出侧的浪涌电流、过压以及长期热应力对失效机理的影响。建议在产品设计阶段进行热仿真与湿热/循环测试验证。
相较于机械继电器或传统光耦加外部开关方案,GAQY214DEH 的优势在于体积小、耐高压(高达400V)、对交流/直流输入兼容、无触点寿命长、开关无机械抖动。适合高压低电流、要求隔离且对机械寿命或噪声敏感的应用场合。选型时应综合考量连续电流(130mA)、开关速度(500µs)与散热约束,确保满足目标系统的功率与安全规范。若需更详细的极限参数、漏电流、隔离耐压与时序特性,请查阅供应商完整规格书或联系SUPSiC技术支持获取样片与应用建议。
Request for quote
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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