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SUPSiC GAQY214EH
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQY214EH
- Type
- SUPSIC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQY214EH
- Electronic Component
- 1
- Package
- SMD-4
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.559g
- Electronic Component
- 1
- Electronic Component
- BM0226465255
- Resistor
- 20Ω
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 400V
- Type
- AC,DC
- (Pd)
- 350mW
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQY214EH 产品概述
一、产品简介
GAQY214EH 是 SUPSiC（国晶微半导体）推出的一款小型 SMD-4 封装隔离固态开关器件，采用光电隔离技术实现信号与电源之间的高压隔离。器件触点形式为 1A（单刀单掷 - 常开），支持 AC / DC 输入驱动，适用于对微弱控制信号与高压负载之间做可靠隔离与开关控制的场景。
二、主要性能特点
- 隔离电压：5 kVrms，满足严格的安全隔离要求；
- 输入特性：正向电压 Vf=1.2 V，最大工作电流 If=30 mA（驱动端兼容单片机、逻辑电平及开关电路）；
- 输出能力：连续负载电流 130 mA，最大负载电压 400 V，导通电阻约 20 Ω；
- 开关性能：导通时间 Ton≈500 μs，截止时间 Toff≈30 μs，适合中低速开关与脉冲控制；
- 功耗与温度：总功耗 Pd=350 mW，工作温度范围 -40 ℃ 至 +85 ℃；
- 封装：SMD-4，适合自动贴片、体积受限的 PCB 设计。
三、典型应用场景
- 工业控制信号隔离：PLC、传感器接口、继电器替代；
- 通讯与测量设备：需要高压隔离的模拟/数字信号路径；
- 家电及安防：小功率开关、指示灯控制、继电器驱动前端；
- 医疗电子（非直接接触患者部位）：对隔离要求高且电流要求较低的控制环节。
四、设计与使用建议
- 驱动端：Vf=1.2 V、If≤30 mA，建议使用限流电阻或驱动器配合，避免长期过流；
- 散热与功耗：Pd=350 mW，为延长器件寿命与稳定工作，应在 PCB 上提供适当铜箔散热，并考虑环境温度下的功率降额；
- 负载类型：连续负载电流 130 mA，导通电阻 20 Ω，适用于中低功率阻性或小容量容性负载。对感性负载（电机、继电器线圈）应增加吸收元件或 RC 抑制，防止高压瞬变；
- 开关时序：Ton≈500 μs，Toff≈30 μs，适合多数控制与测量场合；若用于精确脉冲控制，请提前评估响应带宽与延迟对系统的影响；
- PCB 布局：保持输入与输出隔离区的爬电距离与间隙，按产品 5 kVrms 等级设计隔离走线与挡距；SMD-4 封装应遵循厂商推荐的焊盘和回流工艺。
五、可靠性与选型注意点
在选型时，确认系统最大工作电压、最大通态电流和开关频率是否匹配 GAQY214EH 的规格。器件在高湿、高温环境下的长期可靠性依赖于合适的封装密封与 PCB 防护设计。对于高压或高能量场合，建议做充分的浪涌与耐压测试，并在最终产品中加入必要的过流、过压保护措施。
总体而言，GAQY214EH 以其高隔离电压、小型 SMD 封装、支持 AC/DC 驱动以及适中的开关性能，适合用于需要安全隔离且负载功率不大的各类电子控制与信号隔离应用。欲获取焊盘尺寸、典型应用电路与完整电气特性曲线，请参阅官方数据手册以完成最终电路设计验证。
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