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SUPSiC GAQW212GS
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQW212GS
- Type
- SUPSIC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQW212GS
- Electronic Component
- 1
- Package
- SOP-8
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.66g
- Electronic Component
- 1
- Electronic Component
- BM0257658489
- Resistor
- 800mΩ
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 60V
- Type
- AC,DC
- (Pd)
- 500mW
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQW212GS 产品概述
一、产品简介
GAQW212GS 是 SUPSiC（国晶微半导体）推出的一款双刀单掷（2A，常开）固态光电开关器件（PhotoMOS 类固态继电器），采用 SOP-8 封装。器件集成光隔离输入与低阻抗输出开关，适用于需要高隔离、低导通损耗及长寿命的信号/功率切换场合。
二、主要电气参数
- 触点形式：2A（双刀单掷 - 常开）
- 连续负载电流：500 mA
- 负载电压：60 V（最大）
- 正向压降（Vf，输入侧）：1.2 V（典型）
- 正向电流（If，输入驱动）：7 mA（典型）
- 导通电阻：800 mΩ（典型）
- 隔离电压（Vrms）：2.5 kV
- 导通时间（Ton）：350 µs（典型）
- 截止时间（Toff）：200 µs（典型）
- 输入类型：AC / DC（可接受交流或直流驱动）
- 工作温度范围：-40 ℃ ~ +85 ℃
- 总功耗（Pd）：500 mW
- 封装：SOP-8
三、主要特点
- 双通道独立常开触点，便于同时控制两个回路或实现双路隔离。
- 低导通电阻（约 800 mΩ），在 500 mA 连续负载下具有较小压降与发热。
- 输入驱动电流低（If 约 7 mA），支持微控制器直驱或通过限流器件驱动。
- 隔离能力达 2.5 kVrms，适合高隔离需求的工业与通信系统。
- 支持 AC/DC 输入，拓展了驱动方式的灵活性。
- 响应速度适合中低速开关应用（Ton/Toff 分别约 350 µs / 200 µs）。
四、典型应用
- 工业控制与数据采集中的信号隔离与开关。
- 测试测量设备的通断控制与多路切换。
- 通信设备中需要高隔离的线路切换。
- 电源管理、继电器替代方案，用于降低机械磨损与提高寿命。
- 医疗类低功率隔离信号开关（需按系统安全标准评估）。
五、使用与设计建议
- 在 500 mA 连续工作下关注封装及 PCB 散热，建议在器件引脚周围设计适当的铜箔热沉与过孔，必要时在 PCB 底层加大铜面积。
- 总功耗 Pd 为 500 mW，应在系统热预算中留有裕量，避免长期满功耗工况。
- 输入侧驱动时按 Vf≈1.2 V 与 If≈7 mA 选择限流电阻，交流驱动时注意极性与驱动波形。
- 输出侧若用于感性负载，建议在外部并联适当的吸收网络（如 RC 或二极管）以保护器件与延长寿命。
- 设计时考虑 Ton/Toff 为数百微秒级，不适合高频开关场合。
六、封装与环境适配
- 封装为 SOP-8，适合自动化贴片与常规 PCB 布局。
- 工作温度范围 -40 ℃ ~ +85 ℃，适合多数工业与民用环境。
- 为保证长期可靠性，存储与回流焊接过程应遵循供应商的封装与回流温度规范（具体请参考 SUPSiC 提供的器件资料）。
如需引脚定义、典型电路、可靠性试验数据或具体封装图纸，请告知，我可继续提供更详细的工程资料与选型建议。
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