WMSIC Electronic Components

SUPSiC GAQY237S

ModelGAQY237S
PackageSOP-4
BrandSUPSIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SUPSi C GAQY237S
Type
SUPSIC
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUPSIC
Electronic Component
GAQY237S
Electronic Component
1
Package
SOP-4
Electronic Component
Solid State Relay (MOS Output)
Electronic Component
0.181g
Electronic Component
1
Electronic Component
BM0226465241
Resistor
1.8Ω
Operating Temperature
40℃~+85℃
Electronic Component
2A
Load Voltage
200V
Type
AC,DC
(Pd)
500mW
(Vf)
1.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GAQY237S 产品概述

GAQY237S 是 SUPSiC(国晶微半导体)出品的一款小封装光电隔离固态开关,采用 SOP-4 封装,面向信号与低功率负载的安全隔离与快速切换场景。器件集成了输入发光元件与输出开关单元,支持 AC / DC 输入,具有高隔离性能与稳定的导通特性,适合现代电子系统中的继电、信号切换与保护应用。

一 特性

  • 隔离电压:2.5 kVrms,提供可靠的输入-输出电气隔离,满足一般工业与通信系统的安全隔离需求。
  • 触点形式:SPST-NO(1 Form A),常开单刀单掷结构,输出闭合时导通。
  • 导通电阻:典型 1.8 Ω,导通损耗低,适合较大电流的直流或低频开关。
  • 连续负载电流:400 mA,适用于小功率继电与驱动应用。
  • 负载电压(耐压):200 V,可在较高电压场合工作。
  • 开关速度:导通时间 Ton = 50 μs,截止时间 Toff = 20 μs,满足多数信号切换与脉冲控制需求。
  • 输入驱动:正向电流 If = 7 mA,正向压降 Vf = 1.2 V,支持 AC 与 DC 驱动方式。
  • 总功耗 Pd = 500 mW,器件热耗需在散热设计中考虑。
  • 工作温度:-40 ℃ ~ +85 ℃,适应工业级温度范围。
  • 封装:SOP-4,便于贴片生产与 PCB 布局。

二 典型应用场景

  • 工业控制线路中的信号隔离与开关(传感器信号切换、状态指示回路)。
  • 通信设备的线路保护与远端控制开关。
  • 小型电源与电池管理系统的低功率继电与断路功能。
  • 家电或消费电子中需要电气隔离的数字输出/输入接口。
  • PWM 或脉冲控制的信号级驱动(注意开关频率受开关时间限制)。

三 电气性能与使用建议

  • 输入端:器件支持 AC 与 DC 输入,典型驱动电流 If = 7 mA,驱动电路应保证在该电流附近以获得标称导通性能;若用脉冲驱动,应考虑 Vf 与驱动源能力。
  • 输出端:在连续 400 mA 负载下工作时,需注意器件功耗 Pd(500 mW)和封装散热能力;建议在 PCB 上设计良好散热路径并避免长期满载工作。
  • 开关特性:Ton=50 μs、Toff=20 μs,适合低中频切换;若用于高频 PWM,应评估开关损耗和输出波形的保真度。
  • 抗感性负载:对感性负载(电感、直流电机等)建议并联限幅或吸收电路(如 RC 或 TVS)以抑制反向电压尖峰,保护输出开关单元。
  • 安全隔离与布板:保证输入与输出之间的爬电距离与间隙,以及与其他高压回路的合理间隔,发挥 2.5 kVrms 隔离能力。

四 可靠性与热管理

  • 封装热阻限制了长时间高电流工作的能力,建议在长期或高环境温度场合下对输出电流进行适当降额。
  • 工作温度范围为 -40 ℃ 到 +85 ℃,在高温条件下需控制器件结温,避免超过可靠工作区。
  • 在 PCB 设计上,可增加铜箔面积、过孔散热或使用散热层以降低结温,保证器件长期可靠性。

五 封装与选型提示

  • 封装为 SOP-4,适合表面贴装工艺;选择时注意封装的引脚排列与 PCB 尺寸匹配。
  • 选型时若需更高电流或更低导通电阻,应比较具有更低 RON 或更大 Pd 的型号;若需更高隔离等级,则选择更高 Vrms 标称的器件。

六 注意事项

  • 请严格参考器件的完整规格书(Datasheet)进行应用设计,尤其关注最大额定值、热阻参数及开关特性随输入电流的变化。
  • 在实际电路中进行长时间烧机与环境测试,验证温升、开关寿命与对电磁干扰的敏感性。

总结:GAQY237S 在小型化、隔离可靠性与低导通损耗方面表现突出,适合广泛的信号隔离与低功率开关应用,但在高负载或高温环境需重视热管理与降额设计。若需完整电气曲线与引脚定义,请参阅 SUPSiC 官方 Datasheet 与应用说明。

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