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SUPSiC GAQY211G2EH
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQY211G2EH
- Type
- SUPSIC
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQY211G2EH
- Electronic Component
- 1
- Package
- SMD-4
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.569g
- Electronic Component
- 1
- Electronic Component
- BM0225219154
- Resistor
- 60mΩ
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 40V
- Type
- AC,DC
- (Pd)
- 2W
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQY211G2EH 产品概述
一、主要参数
GAQY211G2EH（品牌：SUPSiC / 国晶微半导体），是一款隔离输出型SMD封装器件，主要电气与机械参数如下：隔离电压 5 kVrms；触点形式 1A（单刀单掷-常开）；工作温度范围 -40℃ ~ +85℃；输入正向压降 Vf = 1.2 V；输入正向电流 If = 50 mA（最大）；输入类型支持 AC 与 DC；连续负载电流 2 A；负载电压最高 40 V；导通电阻 60 mΩ；导通时间 Ton = 800 μs；截止时间 Toff = 20 μs；总功耗 Pd = 2 W；封装为 SMD-4。
二、产品特性与优势
- 高隔离能力：5 kVrms 的隔离电压保证了输入与输出之间良好的绝缘性能，适合需要强化隔离的应用场景。
- 低导通损耗：60 mΩ 的典型导通电阻配合最大连续 2 A 电流，使器件在导通时功耗较低，有利于提高系统效率。
- 宽温度范围：-40℃ 至 +85℃ 的工作温度满足大多数工业环境要求。
- 输入兼容性强：支持 AC 与 DC 驱动，输入 Vf 仅 1.2 V，If 50 mA 内即可可靠驱动。
- 小型表贴封装：SMD-4 适合现代化自动贴装与高密度电路板布局。
三、典型应用场景
- 工业控制隔离开关、PLC 输出隔离单元；
- 家电和电源管理中的无触点开/关控制；
- 通信设备、智能仪表等需要低导通损耗与高隔离的场合；
- 需要 AC/DC 通用输入并承受中等电流负载的隔离控制通道。
四、热管理与布局建议
- 最大总功耗为 2 W，SMD-4 封装热阻相对较高，建议在 PCB 设计中留出散热铜箔、热 vias 或热沉区域以降低结温。
- 连续 2 A 工作时应评估实际功耗（P = I^2·RDS(on) 近似），并保证器件结温在允许范围内。
- 输入侧应提供合适限流或驱动电路，避免长期超过 If 规范。
五、可靠性与使用注意
- 在高电压隔离场合，注意保证爬电距离与绝缘结构设计以配合器件的 5 kVrms 标称值。
- 开关频繁或脉冲驱动时应评估导通/关断时间（Ton = 800 μs，Toff = 20 μs）对系统响应和电磁发射的影响，并按需增加滤波或缓冲电路。
- 避免在超出额定负载电压（40 V）与连续电流（2 A）环境中长期使用。
六、选型建议
如需在高隔离、低导通损耗且支持 AC/DC 驱动的场景实现无触点开关控制，GAQY211G2EH 是一款合适的选择。在高频开关或更大电流需求下，建议对导通/关断时间与散热能力进行验证，或考虑更高规格的器件。
如需规格书（Datasheet）或封装尺寸图以便 PCB 布局与热仿真，我可以为您整理或对比同类替代型号。
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