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SUPSiC GAQW217EH
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQW217EH
- Type
- SUPSIC
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQW217EH
- Electronic Component
- 1
- Package
- SMD-8P
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 0.647g
- Electronic Component
- 1
- Electronic Component
- BM0258761861
- Resistor
- 5Ω
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 200V
- Type
- AC,DC
- (Pd)
- 500mW
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQW217EH 产品概述
一、产品简介
GAQW217EH 是 SUPSiC（国晶微半导体）推出的一款小封装固态继电器器件，触点形式为 2A（双刀单掷，常开）。器件面向弱电控制与安全隔离场景，支持 AC 与 DC 输入，具有高隔离电压与快速响应特性，适合用于信号切换、微功耗开关及电子替代机械继电器的应用。
二、关键电气参数
- 连续负载电流：200 mA（最大推荐直流/交流连续负载）
- 负载电压：200 V（最大）
- 正向压降 Vf：1.2 V（If = 7 mA）
- 输入正向电流 If：7 mA（典型驱动电流）
- 导通电阻：5 Ω（导通态）
- 隔离电压 Vrms：5 kV（绝缘耐压）
- 导通时间 Ton：约 400 μs；截止时间 Toff：约 50 μs
- 总功耗 Pd：500 mW（器件自身允许的耗散功率）
- 工作温度范围：-40 ℃ 至 +85 ℃
三、热特性与可靠性建议
由于器件最大耗散功率为 500 mW，需要在 PCB 设计时考虑充分的散热通道和铜箔面积，必要时在铜皮下方增加过孔以引导热量至另一面或散热层。在高环境温度或靠近功率源件时建议对输出电流进行降额使用以保证长期可靠性。
四、应用场景
适用于以下典型场合：
- 工业控制与信号隔离开关
- 仪器仪表中的低电流开关与控制继电器替代
- 通信设备、测试测量系统中的远端或本地切换
- 家电与安防系统中的微功耗控制回路
五、封装与安装
器件采用 SMD-8P 封装，便于表面贴装与自动化生产。推荐在 PCB 布局时遵循厂方推荐封装与焊盘尺寸，并按回流焊工艺参数进行焊接。为保持隔离性能，输入与输出区域需在 PCB 上保持适当爬电/击穿距离。
六、典型使用建议
- 驱动端：推荐使用恒流或限流驱动，If ≈ 7 mA 可达到典型导通性能；若需缩短导通时间可适当增流，但注意功耗与器件寿命。
- 负载端：避免长时间在接近 200 mA 的连续极限下运行，必要时选用并联或改用更高额定器件。
- 安全设计：利用 5 kV 隔离电压实现输入输出隔离，但为满足系统安全标准仍需按照相关规范设计爬电距离与接地。
如需原理图示例、封装图或详细特性曲线，可参考供应商数据手册或联系 SUPSiC 获取完整资料。
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