WMSIC Electronic Components

SUPSiC GAQY214DS

ModelGAQY214DS
PackageSOP-4
BrandSUPSIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SUPSi C GAQY214DS
Type
SUPSIC
Minimum package
2000 卷

Technical parameters

Electronic Component
SUPSIC
Electronic Component
GAQY214DS
Electronic Component
1
Package
SOP-4
Electronic Component
Solid State Relay (MOS Output)
Electronic Component
1g
Electronic Component
1
Electronic Component
BM0257658504
Resistor
15Ω
Operating Temperature
40℃~+85℃
Electronic Component
1A
Load Voltage
400V
Type
AC,DC
(Pd)
350mW
(Vf)
1.16V
Current(If)
50mA

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GAQY214DS 产品概述

GAQY214DS 是 SUPSiC(国晶微半导体)推出的一款 SOP-4 封装光电式固态继电器产品,采用单刀单掷常开(1A, SPST-NO)触点形式,适用于对高压隔离与无触点切换有要求的小功率开关场合。

一、主要特性

  • 触点形式:1A(单刀单掷 — 常开)
  • 连续负载电流:130 mA(需按温度与散热条件适当降额)
  • 负载电压:最高 400 V
  • 输入类型:支持 AC 与 DC 驱动(实际 AC 驱动需配合限流或整流电路)
  • 封装:SOP-4,便于表面贴装与批量生产

二、电气参数(典型/参考)

  • 正向压降(Vf):1.16 V(在指定 If 条件下的典型值)
  • 正向电流(If):50 mA(作为驱动参考,可依据所需导通特性调整)
  • 导通时间(Ton):约 120 μs(属于中等响应速度,适合信号及低频开关)

三、应用场景

适用于需要电气隔离、无触点长寿命切换的小功率场合,例如:

  • 工业控制与传感器接口
  • 仪器仪表、测试测量设备
  • 通信设备中的信号路由
  • 需要避免机械触点抖动或电弧的场合

四、设计与使用注意事项

  • 驱动:若直接驱动 LED,参考 If≈50 mA 条件以确保可靠导通;对 AC 输入建议使用限流或整流设计,防止 LED 反向过压。
  • 热管理:130 mA 为连续最大值,实际电流应根据 PCB 散热、环境温度与封装热阻进行降额,以保证长期可靠性。SOP-4 热散布受限,建议加宽铜箔或增加散热层。
  • 开关频率:Ton≈120 μs,适合低频或脉冲信号,非高频 PWM 开关组件。
  • PCB 布局:保持输入与输出的隔离爬电距离,合理布置接地与测试点,避免高压侧与控制侧串扰。

五、可靠性与检验

固态无触点结构带来高耐久性与抗震性,常见可靠性试验包括高压绝缘、温升、循环寿命与 ESD 抗扰度测试。量产时建议参考 SUPSiC 的完整数据手册与应用笔记,结合样品验证实际工况下的温升与导通损耗。

总结:GAQY214DS 在 SOP-4 小尺寸封装中提供 400 V 耐压与 130 mA 连续负载能力,适合需要隔离与长寿命切换的低功率应用。选型与电路设计时应重视驱动电流、散热与开关速度的匹配,以获得最佳性能与可靠性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.