WMSIC Electronic Components

SUPSiC GAQY214E

ModelGAQY214E
PackageDIP-4
BrandSUPSIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SUPSi C GAQY214E
Type
SUPSIC
Minimum package
100 袋

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUPSIC
Electronic Component
GAQY214E
Electronic Component
1
Package
DIP-4
Electronic Component
Solid State Relay (MOS Output)
Electronic Component
0.577g
Electronic Component
1
Electronic Component
BM0258761865
Resistor
20Ω
Operating Temperature
40℃~+85℃
Electronic Component
2A
Load Voltage
400V
Type
AC,DC
(Pd)
350mW
(Vf)
1.2V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GAQY214E 产品概述

一、产品简介

GAQY214E 是 SUPSiC(国晶微半导体)推出的一款高隔离、小功耗的四脚 DIP 封装固态继电器/光电隔离开关元件(触点形式:1A,单刀单掷常开)。器件输入端支持 AC/DC 驱动,输出端可在最高 400V 负载电压下工作,适合对信号隔离、弱电控制与高压侧安全隔离有要求的场合。

二、主要电气性能

  • 输出承载:连续负载电流 130mA,最大负载电压 400V(阻断态)。
  • 输入特性:正向压降 Vf ≈ 1.2V(If 参考值 30mA),输入可用交流或直流驱动,推荐驱动电流不超过 If 额定值。
  • 导通态指标:导通电阻约 20Ω(典型),导通时间 Ton ≈ 500μs,截止时间 Toff ≈ 30μs。
  • 隔离与耐压:端到端隔离电压 Vrms 5kV,工作温度范围 -40℃ ~ +85℃,器件总功耗 Pd 350mW。封装为 DIP-4,便于插针安装与线路板调试。

三、优势与应用场景

GAQY214E 结合高隔离电压与低功耗特点,适合以下场景:

  • 工业控制板中对高压侧小电流开关的信号隔离;
  • 通信设备与仪器仪表的低频继电与保护电路;
  • 家电或安防系统中的控制/指示电路隔离;
  • 需要通过光电隔离实现交流或直流触发的小功率负载控制。

四、典型使用建议与注意事项

  • 驱动侧:推荐使用恒流或限流电阻按 Vf≈1.2V、If≤30mA 校准,AC 驱动时应考虑半波整流与交流两极保护。
  • 负载侧:输出在导通时产生的压降由导通电阻决定(R_on≈20Ω),在 130mA 电流下对应的功耗与压降需计算并确认不超出 Pd 350mW 限值;长期高温使用应考虑降额。
  • 开关频率:由于 Ton ≈ 500μs,器件更适用于低频或开/关间隔较长的应用场景,不推荐用于高频脉冲切换。
  • 安装与散热:DIP-4 封装易于插装,焊接时避免过热;在高温或靠近热源的板上,应注意热量累积并适当留有散热空间。
  • 安全与测试:进行系统耐压与绝缘测试时,按 Vrms 5kV 等级进行考虑,佩戴绝缘设备并遵循相关测试规范。

五、封装与采购参考

器件采用标准 DIP-4 封装,便于手工焊接和批量生产的 PCB 布局。选型与采购时请确认供应商批号、生产日期与完整数据手册,必要时向供应方索取详细引脚定义、典型电路和可靠性检验报告,以便在目标应用中进行充分验证。

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