WMSIC Electronic Components

SUPSiC GC3D04060A

ModelGC3D04060A
PackageTO-220-2
BrandSUPSIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SUPSi C GC3D04060A
Type
SUPSIC
Minimum package
50 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUPSIC
Electronic Component
GC3D04060A
Electronic Component
1
Package
TO-220-2
Electronic Component
Diode
Electronic Component
3.006g
Electronic Component
1
Electronic Component
BM0257658495
Current
13.5A
Diode
1
Current(Ir)
25uA@600V
(Vf)
1.7V@4A
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component
Electronic Component
50

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GC3D04060A 产品概述

一、产品简介

GC3D04060A 是国晶微半导体(SUPSiC)面向中高压功率应用的一款碳化硅肖特基整流二极管,采用 TO-220-2 封装。器件在 600V 反向电压等级下提供较低的正向压降和极低的反向漏电流,并支持宽范围工作结温,适合高效、紧凑的电源与电力电子系统。

二、主要电气参数

  • 整流电流(连续):13.5 A
  • 典型正向压降 Vf:1.7 V @ 4 A
  • 直流反向耐压 Vr:600 V
  • 反向电流 Ir:25 μA @ 600 V
  • 非重复峰值浪涌电流 Ifsm:30.5 A
  • 工作结温范围:-55 ℃ ~ +175 ℃

三、产品特点与优势

  • 低正向电压:Vf=1.7V(4A)显著降低导通损耗,有利于提升系统效率并减小散热需求。
  • 低反向漏电:在 600V 条件下 Ir 仅 25 μA,有利于降低空载损耗及待机功耗。
  • 高温工作能力:结温上限达 175 ℃,适应恶劣热工况并提升可靠性裕度。
  • 良好的浪涌承受能力:Ifsm 达 30.5A,可应对短时启动或故障浪涌冲击。
  • 标准 TO-220-2 封装:便于安装、散热和与常规电源模块兼容。

四、典型应用场景

  • 开关电源(SMPS)整流与续流回路
  • 功率因数校正(PFC)二极管
  • 光伏逆变器与储能电源的整流/保护电路
  • 电机驱动及工业电源
  • 充电桩、高压直流链路中的防反接/续流应用

五、设计与使用建议

  • 散热设计:尽管 SiC 允许高结温,仍建议使用适当散热片或强制风冷以保证长期可靠性;在 TO-220-2 封装下应尽量减低结-壳温差。
  • 浪涌与稳压:对可能出现的大电流冲击场合,配合合适的限流元件或软启动电路;必要时并联低阻抗阻尼或 RC 吸收网络以抑制瞬态。
  • 并联与分流:并联使用时注意每颗器件的电性与热阻匹配,避免因温度系数差异导致电流不均。
  • 焊接与可靠性:遵循供应商焊接温度曲线与封装处理指导,避免在高温或长时间热循环下影响性能。

六、可靠性与选型提示

GC3D04060A 以 SiC 肖特基结构在高压、高频、高温场合表现优异。选型时请结合系统的最大工作电压、脉冲浪涌幅值和功率损耗预算,评估是否需要更高电流或更低 Vf 的型号;系统认证与长期可靠性验证应按行业标准进行。

如需完整的器件晶体管图、典型电路、热阻及封装尺寸等详细资料,请参考供应商数据手册或联系 SUPSiC 技术支持获取最新规格说明。

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