WMSIC Electronic Components

SUPSiC GAQY212E

ModelGAQY212E
PackageDIP-4
BrandSUPSIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SUPSi C GAQY212E
Type
SUPSIC
Minimum package
100 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUPSIC
Electronic Component
GAQY212E
Electronic Component
1
Package
DIP-4
Electronic Component
Solid State Relay (MOS Output)
Electronic Component
0.372g
Electronic Component
1
Electronic Component
BM0229953543
Resistor
800mΩ
Operating Temperature
40℃~+85℃
Resistor
5000MΩ
Electronic Component
2A
Load Voltage
60V
Type
AC,DC
(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GAQY212E 产品概述

一、产品简介

GAQY212E 是 SUPSiC(国晶微半导体)面向精密信号隔离与小电流负载切换场合推出的一款光隔离固态开关器件(PhotoMOS 类特性),封装为常见的 DIP-4 直插封装。器件输入侧采用 LED 驱动,输出侧为 MOSFET 风格的固态触点,提供机械继电器类似的“1A(单刀单掷-常开)”触点形式,但具有无触点、寿命长、无火花和高速响应等固态器件优点。

二、主要特性

  • 触点形式:1A(单刀单掷,常开)
  • 连续负载电流:500 mA
  • 负载电压范围:最大 60 V
  • 输入正向压降(Vf):1.32 V(If = 7 mA 条件下)
  • 建议输入正向电流(If):典型 7 mA
  • 导通电阻:800 mΩ(导通状态下)
  • 隔离电压(Vrms):3.75 kV(输入与输出之间)
  • 导通/截止响应:Ton ≈ 500 µs,Toff ≈ 50 µs
  • 输入类型兼容:AC / DC 驱动
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 总功耗(Pd):500 mW
  • 绝缘电阻:5000 MΩ
  • 封装:DIP-4,便于通孔安装与原型调试

三、电气性能要点

  • 导通电阻 800 mΩ 在 500 mA 连续工作时对应输出端功耗约 0.2 W(P = I^2·R),加上输入 LED 的功耗,需要注意封装热耗散不要超出器件 Pd=500 mW 限制,必要时采用降低占空比或外部散热。
  • 在最大负载(500 mA、60 V)下器件的总功耗与发热需评估:尽管单侧损耗不高,但长期工作及高环境温度下应留有余量。
  • 隔离能力 Vrms=3.75 kV 适用于多数工业/仪表级安全隔离需求,配合高绝缘电阻(5000 MΩ)可有效抑制泄漏与干扰。
  • 开关速度方面,Ton 较 Toff 慢(500 µs vs 50 µs),适合多数信号切换和低速开关场合,但不适合高频 PWM 或亚毫秒精确时序的驱动。

四、典型应用场景

  • 仪器仪表中的信号路由与隔离:数据采集、传感器开关、模拟/离散信号隔离
  • 电信与通信设备的电平转换与隔离保护
  • 工业控制与自动化系统中的小电流负载切换
  • 医疗设备、测试测量设备中对高隔离要求的控制回路
  • 需要长寿命、无接触开关的低功耗便携设备

五、使用建议与注意事项

  • 驱动:采用恒定电流或限流电阻驱动输入 LED,推荐 If≈7 mA 为典型工作点。若使用 AC 驱动,需注意正负半周的驱动方式与极性保护。
  • 热管理:在接近最大连续电流或高环境温度工作时,应评估 PCB 散热和器件功耗,避免长期在 Pd 上限附近运行。
  • 开关频率:器件 Ton=500 µs,Toff=50 µs,适合低频或直通切换应用;若需更快响应请选用专用高速器件。
  • 隔离与安全:器件满足 3.75 kV 隔离,但系统级安全设计仍需考虑爬电距离、工频测试与隔离等级要求。
  • 焊接与封装:DIP-4 通孔封装便于波峰/回流焊后手工调试;注意焊接温度与时长不能超出器件工艺规范(详见产品手册)。

六、封装与可靠性

DIP-4 封装便于工程样机验证与小批量应用,上板牢固、易更换。器件工作温度范围宽(-40 ~ +85 ℃),绝缘与耐压指标适合工业级使用场合。建议在最终设计中参考 SUPSiC 提供的完整数据手册以获取典型电阻-温度特性、绝缘测试条件及可靠性参数,以满足特定应用的认证要求。

总结:GAQY212E 以其 500 mA 的连续负载能力、60 V 的负载电压范围和 3.75 kV 的高隔离能力,结合固态无触点的可靠性,适合用于仪表、通信与工业控制等需要可靠隔离与小电流切换的场合。选型时请综合考虑导通损耗、开关速度与工作环境温度,必要时参照厂方完整技术手册进行热设计与可靠性验证。

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