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SUPSiC GAQV252G3EH
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GAQV252G3EH
- Type
- SUPSIC
- Minimum package
- 500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GAQV252G3EH
- Electronic Component
- 1
- Package
- SMD-6
- Electronic Component
- Solid State Relay (MOS Output)
- Electronic Component
- 1.17g
- Electronic Component
- 1
- Electronic Component
- BM0229921577
- Resistor
- 50mΩ
- Operating Temperature
- 40℃~+85℃
- Electronic Component
- 2A
- Load Voltage
- 60V
- Type
- AC,DC
- (Pd)
- 550mW
- (Vf)
- 1.2V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GAQV252G3EH 产品概述
一、产品简介
GAQV252G3EH 是 SUPSiC（国晶微半导体）推出的一款高绝缘、低损耗的固态输出开关器件，采用 SMD-6 表面贴装封装。器件为单刀单掷常开（1A）触点形式，集成输入发光元件与输出功率开关，适用于需要高隔离、长寿命、低热耗的开关控制应用。器件支持直流与交流输入，响应速度适中，兼顾开关性能与热管理。
二、主要技术参数
- 触点形式：1A（单刀单掷 - 常开）
- 连续负载电流：3A
- 负载电压：60V
- 导通电阻：50mΩ（典型）
- 正向压降 (Vf)：1.2V
- 正向电流 (If)：7mA（驱动参考）
- 隔离电压 (Vrms)：5kV
- 导通时间 (Ton)：约 2ms
- 截止时间 (Toff)：约 100μs
- 输入类型：AC / DC 兼容
- 工作温度范围：-40℃ ~ +85℃
- 总功耗 (Pd)：550mW
- 封装：SMD-6
三、性能特点
- 高隔离强度：5kV 的隔离电压使器件在信号隔离与安全设计上具备可靠保障，适合工业控制与电源管理场合。
- 低导通损耗：50mΩ 的低导通电阻结合 3A 连续电流能力，使导通功耗和发热得到有效控制，系统热设计更宽裕。
- 宽输入兼容性：支持 AC 与 DC 驱动，正向驱动电流典型值 7mA，便于与各种微控制器、传感器或驱动电路直接配合。
- 快速关断：100μs 的截止时间适合需要较快断开的应用场景，导通时间为 2ms，适合多数开关控制用途。
- 表面贴装封装：SMD-6 便于自动化贴装和高密度 PCB 布局，利于量产与小型化设计。
四、典型应用场景
- 工业自动化输入/输出隔离模块
- 通信设备的开关控制与保护
- 仪器仪表信号隔离与驱动
- 家电、照明的电子开关替代机械继电器
- 需长寿命、低噪声的固态开关场合
五、封装与可靠性
SMD-6 封装利于自动化贴装和热量散布，推荐根据 PCB 热仿真结果设计铜箔散热区域与焊盘。器件工作温度范围为 -40℃ 至 +85℃，适应常见工业级环境；在高温或高功率工况下，应留足散热裕量并遵循厂商推荐的降额使用规则。
六、使用注意事项
- 最大负载不超过 3A 连续，否则会引起过热和可靠性下降；考虑到总功耗 550mW，建议配合散热设计。
- 输入驱动电流应参考 If = 7mA 以保证稳定导通，AC 输入时注意峰值与平均值关系。
- 在高压隔离要求的系统中，遵循爬电距离与绝缘设计规范以配合器件的 5kV 隔离能力。
- 在实际应用中建议进行上电寿命与热循环测试，验证金属焊盘与封装可承受的应力。
如需详细引脚排列、典型电路、以及更完整的电气特性曲线与封装尺寸，请联系供应商获取完整数据手册。
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