Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
Available for RFQ
Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GC4D15120H 为 SUPSiC(国晶微半导体)出品的碳化硅(SiC)肖特基整流二极管,额定直流反向耐压 1200V,整流电流 39A,典型正向压降 Vf≈1.5V,反向漏电流 Ir≤200µA(@1200V),工作结温范围宽至 -55°C ~ +175°C,常见封装为 TO-247-2,便于与散热片直接结合使用。该器件专为高压、高温、高效率的整流与开关应用设计。
GC4D15120H 相比传统硅整流器具有导通损耗低、耐高温、开关损耗小、体积/散热优势明显等特点。典型应用场景包括:
TO-247-2 封装便于安装至散热片,建议:
器件在高结温下仍能保持性能稳定,但长期可靠性依赖于正确的热设计与电应力控制。封装在散热、焊接与机械应力方面需遵循供应商的封装与装配指南。此外,SiC 器件对瞬态过压与应力较敏感,选型时建议给出合适的安全余量并配合保护电路。
在选型时请核对完整数据表(如峰值浪涌电流、热阻 RθJC、引脚排列与尺寸、最大结温与封装限制等)。如需样片、批量采购或获取详细应用曲线与参考电路,请联系 SUPSiC 或授权分销商获取最新版技术资料与支持。
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Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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