Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SUPSiC GC3M0015065K
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GC3M0015065K
- Type
- SUPSIC
- Minimum package
- 30 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GC3M0015065K
- Electronic Component
- 1
- Package
- TO-247-4
- Electronic Component
- 1 N
- Type
- N
- Electronic Component
- MOSFET
- Electronic Component
- 8.7g
- Electronic Component
- 1
- Electronic Component
- BM0227373198
- Operating Temperature
- 40℃~+175℃
- Power Dissipation(Pd)
- 416W
- Electronic Component
- Electronic Component
- Electronic Component
- 30
- Voltage(Vdss)
- 650V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GC3M0015065K 产品概述
一、主要参数概览
- 器件类型：N沟道功率MOSFET（单颗）
- 品牌：SUPSiC（国晶微半导体）
- 漏源电压 Vdss：650 V
- 连续漏极电流 Id：120 A
- 耗散功率 Pd：416 W（注：实际散热能力受散热条件与安装方式影响）
- 阈值电压 Vgs(th)：2.3 V
- 导通电阻 RDS(on)：15 mΩ @ Vgs=15 V
- 栅极电荷 Qg：188 nC
- 输入电容 Ciss：5.011 nF
- 输出电容 Coss：289 pF
- 反向传输电容 Crss（Cgd）：31 pF
- 工作温度范围：-40 ℃ ~ +175 ℃
- 封装：TO-247-4
二、关键特性与优势
- 高耐压（650 V）适合中高压转换场合；较低的 RDS(on)（15 mΩ）在高电流工作时能显著降低导通损耗。
- 较大的连续电流能力（120 A）配合 TO-247-4 封装，适用于大功率开关和逆变模块。
- 栅极电荷 Qg 较大（188 nC），但 Crss（31 pF）相对较小，有利于降低米勒效应对开关瞬态的影响，适合在对导通损耗和开关损耗需要权衡的设计中使用。
- 宽温度范围（最高可达175 ℃）提高了系统在苛刻环境下的可靠性边界。
三、驱动与开关建议
- 由于 Qg=188 nC，建议使用具备高峰值电流能力的驱动器（10 A 以上峰值）以缩短开关时间并控制开关损耗；栅极驱动电压优选 12–15 V。
- 为抑制过冲和振铃，建议在栅极串联适当的阻容（Rg、Cgd缓冲或RC阻尼）并配合合适的驱动回路布局与走线。
- 在高频开关应用中需平衡开关速度与 EMI，适当增加栅阻可以降低电磁干扰但会增大开关损耗。
四、热管理与封装注意
- TO-247-4 提供良好的散热面和可螺栓安装结构，建议使用铜底散热器并配合合适的热界面材料（导热硅脂或绝缘片）以降低结壳热阻。
- 标注的耗散功率 416 W 为器件在理想散热条件下的额定能力；实际设计时应参考器件数据手册中的 θJC/θJA，并根据系统环境与散热方案计算结温。
五、典型应用场景
- 350–700 V 级别的开关电源（PFC、主开关）
- 电机驱动与伺服放大器
- 不间断电源（UPS）与逆变器
- 太阳能逆变器与储能变流器
- 大功率开关模块、整流与软开关电路
六、选型与可靠性考量
- 若系统对开关损耗极为敏感，可结合软开关拓扑或并联低 RDS(on) 器件以降低每颗器件的应力；并联时需注意电流分享和散热均衡。
- 对于高环境温度或受限散热空间的设计，应留足额外的安全裕量并验证结温在最大工作条件下的表现。
- 最终应用前建议参考完整数据手册进行脉冲额定、热阻、SOA 等详细参数校核，并在样机阶段进行热仿真与长期可靠性测试。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
