WMSIC Electronic Components

SUPSiC GC4D40120H

ModelGC4D40120H
PackageTO-247-2
BrandSUPSIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SUPSi C GC4D40120H
Type
SUPSIC
Minimum package
30 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUPSIC
Electronic Component
GC4D40120H
Electronic Component
1
Package
TO-247-2
Electronic Component
Diode
Electronic Component
8.337g
Electronic Component
1
Electronic Component
BM0229953527
Current
128A
Diode
1
Current(Ir)
300uA@1200V
(Vf)
1.5V
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component
Electronic Component
30

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GC4D40120H 产品概述

GC4D40120H 是 SUPSiC(国晶微半导体)推出的一款高压碳化硅整流二极管,面向高能量密度、低损耗和高温工作场景。该器件采用 TO-247-2 封装,兼顾大电流传导能力与方便的散热安装方式,适用于中高功率电源系统和工业逆变等对可靠性与效率要求较高的应用。

一、主要参数速览

  • 整流电流(IF):128 A(直流额定整流电流)
  • 正向压降(Vf):1.5 V(典型/或最大工作区间)
  • 直流反向耐压(Vr / Vrrm):1200 V
  • 反向电流(Ir):300 μA @ 1200 V
  • 非重复峰值浪涌电流(Ifsm):247 A
  • 工作结温范围(Tj):-55 °C ~ +175 °C
  • 封装:TO-247-2
  • 品牌:SUPSiC(国晶微半导体)

二、关键特性与优势

  1. 低正向压降:Vf 约为 1.5 V,较传统硅整流器在相同电流下有更低的导通损耗,有利于提高系统效率并降低散热需求。
  2. 高耐压能力:1200 V 的反向耐压等级使其适用于高压直流链路和中高电压逆变器。
  3. 高温可靠性:结温允许工作上限高达 175 °C,适合高温环境或对热裕量要求高的设计,减少系统因温升而需的额外散热设计空间。
  4. 低反向漏流:在 1200 V 时 Ir 为 300 μA,体现了良好的关断特性,有利于降低空载及停机时的静态损耗。
  5. 良好抗浪涌能力:Ifsm 达到 247 A,增强了器件对短时冲击电流的承受能力,例如启动、短路或充电瞬态情况。

三、典型应用场景

  • 有源整流(PFC)前端与高压整流器
  • 太阳能逆变器、风力发电整流与逆变单元
  • 电动车充电桩(OBC / DC fast charger)与电源模块
  • 中高功率开关电源(SMPS)、服务器电源及工控电源
  • 电焊、电机驱动与其他需耐高压、高温和大电流的工业应用

四、封装与热管理建议

GC4D40120H 采用 TO-247-2 封装,具有良好的散热通道与可靠的机械安装方式。针对高电流与高结温使用场景,建议注意以下热管理要点:

  • 采用合适的散热器或冷板,确保器件结温在额定范围内。
  • 在高功率工作点下进行结到壳(或结到环境)热阻评估,并留有安全裕度。
  • 安装时使用合适的绝缘垫和导热胶(如需要电气隔离),同时保证紧固件与散热基板的良好热接触。
  • 在 PCB 设计上配合大面积铜箔、散热过孔等手段降低结至环境热阻。

五、选用与应用注意事项

  • 结温管理:尽管器件支持高达 175 °C 的结温,但长时间接近该上限会影响可靠性与寿命,建议在系统级热仿真后进行合理的温度裕度设计。
  • 浪涌与短时过载:Ifsm 为非重复峰值浪涌电流,适用于短时冲击,但在反复或长时间过载条件下仍需采取限流或保护措施。
  • 反向恢复特性:碳化硅肖特基/整流二极管通常具有非常快的恢复特性,能降低开关损耗;在并联或高速开关拓扑中需注意电磁兼容与寄生振荡问题,必要时配合合适的吸收网络或阻尼措施。
  • 兼容性与替换:在升级自硅整流器至 SiC 器件时,请重新评估系统的电压应力、浪涌能量以及散热设计,以确保整体可靠性。

六、采购与技术支持

作为 SUPSiC(国晶微半导体)系列产品,GC4D40120H 在选型前建议查阅最新的官方数据手册,获取更详细的特性曲线(Vf 与温度关系、反向恢复波形、热阻参数、机械尺寸及焊接/安装指南)。在批量采购与量产前,建议与供应商沟通样片、可靠性测试和长期供货保障事宜。

总结:GC4D40120H 以其 1200 V 的耐压等级、128 A 的整流能力、较低的正向压降和高温工作特性,适合在高效能、高可靠性的电力电子系统中替代传统硅整流器,从而在系统层面实现效率提升与体积/散热优化。若需进一步的电气参数曲线、热特性或应用参考电路,可提供具体应用场景,我可协助进行更深入的匹配与设计建议。

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