WMSIC Electronic Components

SUPSiC GC4D20120D

ModelGC4D20120D
PackageTO-247-3
BrandSUPSIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SUPSi C GC4D20120D
Type
SUPSIC
Minimum package
30 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUPSIC
Electronic Component
GC4D20120D
Electronic Component
1
Package
TO-247-3
Electronic Component
Diode
Electronic Component
8.433g
Electronic Component
1
Electronic Component
BM0229953530
Current
34A
Diode
1
Current(Ir)
250uA@1200V
(Vf)
1.5V
Electronic Component
55℃~+175℃
Electronic Component
Electronic Component
Electronic Component
30

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GC4D20120D 产品概述

一、产品概述

GC4D20120D 为 SUPSiC(国晶微半导体)出品的 1200V 等级碳化硅(SiC)肖特基整流二极管,额定整流电流 34A,封装为 TO-247-3。该器件结合了 SiC 材料的高耐压、低正向压降和高温工作能力,适合高效率、高频率及高温环境下的功率整流与自由轮回工作。

二、主要参数与特点

  • 额定整流电流(IF):34 A
  • 直流反向耐压(VR):1200 V
  • 正向压降(Vf):约 1.5 V(典型值,具体见器件曲线)
  • 反向电流(IR):250 μA @ 1200 V
  • 非重复峰值浪涌电流(IFSM):71 A
  • 工作结温范围:-55 ℃ 至 +175 ℃
  • 封装:TO-247-3,便于安装与散热
  • 特性:极低的反向恢复(几乎无反向恢复)和开关损耗,适用于高频开关场合;耐高温、热稳定性好。

三、典型应用场景

  • 开关电源(SMPS)中的高压整流与输出二极管
  • 功率因数校正(PFC)电路
  • 逆变器与光伏(PV)系统的高压整流与保护
  • 电机驱动与电动车充电设施的整流/自由轮回
  • 高频功率变换器与能量回馈系统

四、封装与散热建议

TO-247-3 封装有良好散热能力,但实际使用中仍建议配合合适散热片或强制风冷以保证结温在安全范围内。布局时应尽量缩短高电流回路的连接长度、增大铜箔面积以降低电阻和寄生电感。对于长时间大电流工作,请按厂方曲线进行温度与电流的热密度换算并适当降额使用。

五、选型与工程注意事项

  • 留意反向泄漏随温度上升快速增加,设计时需考虑高温下的漏电流对系统效率与安全的影响;
  • 峰值浪涌能力(IFSM)为非重复值,须避免频繁冲击或超限冲击;
  • 若用于高频开关场合,可充分利用 SiC 肖特基几乎无反向恢复的优势以降低开关损耗;
  • 最终选型应参考器件详细数据手册(IV 曲线、热阻、封装图与焊接规范),并在目标工况下做热仿真与可靠性评估。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.