Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SUPSiC GC4D30120D
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SUPSi C GC4D30120D
- Type
- SUPSIC
- Minimum package
- 30 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SUPSIC
- Electronic Component
- GC4D30120D
- Electronic Component
- 1
- Package
- TO-247-3
- Electronic Component
- Diode
- Electronic Component
- 8.487g
- Electronic Component
- 1
- Electronic Component
- BM0257658498
- Current
- 44A
- Diode
- 1
- Current(Ir)
- 200uA@1200V
- (Vf)
- 1.8V@15A
- Electronic Component
- 55℃~+175℃
- Electronic Component
- Electronic Component
- Electronic Component
- 30
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
GC4D30120D 产品概述
一、产品简介
GC4D30120D 是 SUPSiC（国晶微半导体）推出的一款硅碳（SiC）肖特基功率整流二极管，封装为 TO-247-3。器件额定直流整流电流为 44A，直流反向耐压（Vr）为 1200V，适合高压、轻量化及高效率电力电子系统的整流和自由轮回应用。
二、主要电气参数
- 连续整流电流：44 A
- 正向压降（Vf）：1.8 V @ 15 A
- 直流反向耐压：1200 V
- 反向漏电流（Ir）：200 μA @ 1200 V
- 非重复峰值浪涌电流（Ifsm）：100 A
- 工作结温范围：-55 ℃ ～ +175 ℃
三、关键特性与优势
- 高频开关系统中导通损耗低：SiC肖特基结构在中高电流下具有较低的正向压降，相比同电压等级的硅二极管可显著降低导通损耗。
- 几乎无反向恢复：肖特基特性带来极小的反向恢复电荷，降低开关损耗和电磁干扰（EMI），特别适合高频拓扑。
- 耐高温能力强：工作结温高达 +175 ℃，在热应力或高温环境中具有更宽裕的设计余量。
- 抗浪涌能力：100 A 的峰值浪涌电流能力可满足短时启动或故障状态下的冲击需求。
四、典型应用场景
适用于需要高压耐受和高效率整流的场合，例如：
- 工业与服务器级开关电源中的主整流或 PFC（二次整流）
- 光伏逆变器、储能系统与电动车充电桩的高压整流链路
- 电机驱动、变频器和轨道牵引等中高压动力电子设备
- UPS、备电与中大型电源模块的自由轮回二极管
五、封装与散热建议
TO-247-3 封装便于安装于散热片或模块化母板，实际使用中建议：
- 采用合适的散热片或强制风冷以控制结温，必要时使用热界面材料（TIM）降低热阻；
- 在高温或接近最大电流工况下进行电流降额设计，保证长期可靠性；
- 注意螺丝固定扭矩与引脚焊接工艺，避免应力集中与热循环造成的机械疲劳。
六、可靠性与使用注意
- 在高电压工作点下，虽反向漏电流仅为数百微安，但长期高温会使漏流和功耗增加，应考虑温度相关的降额；
- 器件对浪涌有一定承受力，但频繁的大幅度浪涌会影响寿命，应配合抑制电路或合理保护策略；
- 常规防静电与清洁安装操作，避免颗粒或焊剂残留影响散热和绝缘。
七、总结
GC4D30120D 以 1200V 高耐压、SiC肖特基低正向压降和宽工作温度范围为核心优势，适合需要高效率、低损耗和耐高温的中高压电力电子应用。在设计时结合合理的散热与降额策略，可在高性能整流和高频开关场合显著提升系统效率与可靠性。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
