WMSIC Electronic Components

SUPSiC GC3M0015065D

ModelGC3M0015065D
PackageTO-247-3
BrandSUPSIC
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SUPSi C GC3M0015065D
Type
SUPSIC
Minimum package
30 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SUPSIC
Electronic Component
GC3M0015065D
Electronic Component
1
Package
TO-247-3
Electronic Component
1 N
Type
N
Electronic Component
MOSFET
Electronic Component
8.167g
Electronic Component
1
Electronic Component
BM0229953545
Operating Temperature
40℃~+175℃
Power Dissipation(Pd)
416W
Electronic Component
Electronic Component
Electronic Component
30
Voltage(Vdss)
650V

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GC3M0015065D 产品概述

一 概述

GC3M0015065D 是国晶微半导体(SUPSiC)推出的一款 650V 级碳化硅(SiC)N 沟 MOSFET,采用 TO-247-3 封装。器件以低导通电阻和高温耐受为特点,适用于中高压、高频率电源转换与电机驱动等需要高效率与高可靠性的场合。

二 主要电气参数

  • 类型:N 沟 MOSFET
  • 漏源电压 Vdss:650V
  • 连续漏极电流 Id:120A
  • 耗散功率 Pd:416W(在规定散热条件下)
  • 导通电阻 RDS(on):15mΩ @ Vgs=15V
  • 阈值电压 Vgs(th):2.3V
  • 栅极电荷 Qg:188nC
  • 输入电容 Ciss:5.011nF
  • 输出电容 Coss:289pF
  • 反向传输电容 Crss:31pF
  • 工作结温范围:-40℃ ~ +175℃
  • 封装:TO-247-3

三 关键特性与性能解读

该器件的 15mΩ 导通电阻在 650V 级 SiC 器件中属于适中偏低水平,能显著降低导通损耗;高达 120A 的连续电流能力配合 416W 的耗散能力,适合大电流短时或有良好散热的连续工作。Qg 较大(188nC),表明开关时需较强的驱动能力;Coss 与 Crss 给出器件的电容特性,影响开关能量和电压应力。

四 典型应用场景

  • 650V 级反激、LLC、软开关等中高频开关电源
  • 光伏逆变器与储能系统前端功率开关
  • 电机驱动中的中间母线开关或直流断路器件
  • UPS、不间断电源与工业电源解决方案

五 设计与使用建议

  • 驱动:推荐 0~+15V 强驱动栅极,注意驱动器的瞬时电流能力以满足 188nC 的栅极充放电需求;必要时采用阻尼/限流电阻以抑制振铃。
  • 抗干扰:Crss 较小有利于降低 Miller 效应,但在高 dv/dt 场合需防止误触发,可考虑在栅极施加小幅负压(如 -2~ -5V)或使用合理的栅极回路布局。
  • 热管理:在大电流工作点应采用低热阻散热器或强制风冷/液冷;尽量缩短走线并优化底板散热路径。
  • 保护:建议并用快速熔断、限流检测以及合适的 RC 吸收/负载钳位以防止开关应力与浪涌。

六 封装与可靠性

TO-247-3 提供了良好的散热面与方便的安装方式,适合工程化应用与模块化电源设计。器件工作结温上限 175℃ 赋予系统更高的环境适应能力,但仍需在可靠的散热和热循环管理下使用以延长寿命。

七 小结

GC3M0015065D 将 SiC 的高击穿电压与低导通损耗优势结合在一个中等尺寸封装中,适合对效率和耐热有较高要求的中高压电力电子场景。设计时需重点考虑栅极驱动能力与热管理,以发挥器件的最佳性能。

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