WMSIC Electronic Components

SIT SIT1044QTK/3 SIT1044QTK

ModelSIT1044QTK/3
PackageDFN-8(3x3)
BrandSIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SIT SIT1044QTK / 3
Type
SIT
Minimum package
6000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIT
Electronic Component
SIT1044QTK/3
Electronic Component
1
Package
DFN-8(3x3)
Type
CAN-FDTransceiver
Electronic Component
CAN Transceiver
Electronic Component
0.18g
Electronic Component
1
Channel Count
1
Features
ESD; TXD; Low Power
Electronic Component
BM0227625498
Operating Temperature
40℃~+125℃
Operating Voltage
4.75V~5.25V
Operating Current
30uA
Data
5Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SIT1044QTK/3 产品概述

一、产品简介

SIT1044QTK/3 是芯力特(SIT)推出的一款 CAN-FD 收发器,面向汽车与工业总线物理层应用。器件工作电压为 4.75V 至 5.25V,支持 CAN-FD 数据速率最高至 5 Mbps,工作温度范围宽(-40℃ 至 +125℃),并采用紧凑的 DFN-8(3×3 mm)封装,适合对空间和可靠性有较高要求的系统设计。

二、主要特性

  • 支持 CAN-FD 物理层通信,数据速率最高可达 5 Mbps。
  • 低功耗设计:工作电流/静态电流典型值约 30 µA,适合需常时在线且节能的应用场景。
  • 宽电源范围:4.75V 至 5.25V,直接兼容车规 5V 总线供电。
  • 工业/车规级温度范围:-40℃ 至 +125℃,适合严苛环境下长期可靠运行。
  • 小封装:DFN-8(3×3 mm),利于高密度 PCB 布局与节省空间。

三、电气与功能建议

  • 供电与去耦:在 VCC 与 GND 之间靠近器件引脚放置 0.1 µF 陶瓷去耦电容,必要时并联 1 µF 提升低频去耦性能。
  • 总线终端:在 CANH 与 CANL 之间采用 120 Ω 串联终端电阻,并根据拓扑需要布置分布式终端和共模电感以抑制干扰。
  • 保护与可靠性:在车载或有较强瞬态干扰的环境中,建议在差分线上加装 TVS 二极管与共模扼流器以提高瞬态抗扰能力与电磁兼容性。
  • 接地与布局:将器件的散热焊盘与地平面良好连接,保证热流和信号地回流路径短且连续,差分信号线尽量保持长度匹配并远离高速时钟或开关电源噪声源。

四、封装与机械信息

SIT1044QTK/3 标配 DFN-8(3×3 mm)小尺寸封装,适合表贴工艺。封装中心通常带有裸露散热焊盘(请参考最新封装图纸),便于热管理与可靠焊接。设计 PCB 时请参照制造商提供的推荐焊盘尺寸与回流曲线以确保焊接质量。

五、典型应用

  • 汽车车身控制、车灯、车门及仪表总线节点;
  • 工业自动化现场控制器、传感器节点与执行器接口;
  • 电机控制器与电池管理系统的局部通讯链路;
  • 其他需要 CAN-FD 物理层的小型化、低功耗通信模块。

六、可靠性与设计注意事项

  • 在高温、高湿或强电磁干扰场景下,应做完整的系统级 EMC 与 ESD 测试并适配额外保护元件。
  • 器件长期工作在极限温度或超过额定电压可能影响寿命,建议在设计阶段保留适当裕量并遵循热设计规范。
  • 对于关键安全系统,推荐冗余设计和错误检测恢复机制(如故障隔离、看门狗与总线状态监测)。

七、结语

SIT1044QTK/3 以其低功耗、高温度等级和小型封装,适合用于要求紧凑、可靠的 CAN-FD 通信节点。具体电气特性、引脚定义、典型特性曲线与 PCB 推荐封装请参考芯力特官方数据手册,以获得完整的设计参数和测试条件。若需进一步的原理图参考或布局建议,可提供系统拓扑与限制条件以便给出更具体的设计指导。

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