WMSIC Electronic Components

SIT SIT1042T/3 SIT1042T

ModelSIT1042T/3
PackageSOP-8
BrandSIT
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SIT SIT1042T / 3
Type
SIT
Minimum package
2500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SIT
Electronic Component
SIT1042T/3
Electronic Component
1
Package
SOP-8
Type
CAN-FDTransceiver
Electronic Component
CAN Transceiver
Electronic Component
0.001g
Electronic Component
1
Channel Count
1
Features
TXD; Low Power
Electronic Component
BM0227600343
Operating Temperature
40℃~+150℃
Operating Voltage
5V
Operating Current
70mA
Data
5Mbps

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SIT1042T/3 产品概述

一 产品简介

SIT1042T/3 是芯力特(SIT)推出的一款高可靠性的 CAN‑FD 总线收发器,封装为 SOP‑8(150 mil)。器件工作电压为 5V,支持最高 5 Mbps 的数据速率,既满足经典 CAN 通信,也适配 CAN‑FD 扩展速率的需求,适用于车载、工业控制与恶劣环境下的现场总线应用。

二 主要性能参数

  • 类型:CAN‑FD 收发器
  • 最大数据速率:5 Mbps
  • 工作电压:5 V
  • 工作电流(典型):70 mA(活动通信状态)
  • 静态电流(待机/休眠):≈5 μA
  • 工作温度范围:-40 ℃ ~ +150 ℃
  • 封装:SOP‑8 150 mil(SOP-8_150MIL)
  • 品牌:SIT(芯力特)

三 功能特点

  • 支持 CAN‑FD 协议的物理层传输,兼容现有 CAN 总线拓扑;
  • 低静态电流设计,适合带休眠/唤醒功能的低功耗系统;
  • 宽温工作能力(最高可达 +150 ℃),适合高温场景如动力系统、电机驱动和工业高温腔体;
  • 标准 SOP‑8 封装,便于贴片加工与手工调试;
  • 活动模式下电流约 70 mA,满足高速差分驱动能力;
  • 典型应用环境下可与常见总线保护器件(如 TVS)联合使用以提高抗浪涌和瞬变能力。

四 典型应用场景

  • 汽车电子:动力系统网络、车身控制单元(BCU)、底盘控制等需要高温或耐用性的模块;
  • 工业自动化:现场总线节点、运动控制器、PLC 通讯接口;
  • 军工与航天设备:温度极端或对可靠性要求高的通信节点;
  • 能源与电力设备:高温环境下的监测与保护通信接口。

五 设计与使用建议

  • 电源去耦:在 VCC 引脚靠近器件位置放置 0.1 μF 陶瓷去耦电容,并可并联 1 μF~10 μF 以改善低频特性;
  • 总线终端:两端各并联 120 Ω 差分终端电阻(或根据网络拓扑选择合适终端方案)以保证信号完整性;
  • ESD 与浪涌保护:在 CAN_H/CAN_L 总线上建议并联低漏电流 TVS 或瞬态抑制器,提升抗干扰与浪涌能力;
  • 布局注意:差分对信号线应保持等长、相近阻抗、远离高频噪声源;地回路短且回流路径集中;
  • 热管理:器件活动时功耗约为 0.35 W(5 V × 70 mA),在高温或密集封装场景下应考虑散热路径与 PCB 铜箔面积以降低结温;
  • 供电与唤醒策略:利用其低静态电流特性,可实现休眠唤醒机制以节能,但需保证唤醒线路与总线唤醒条件设计合理。

六 封装与可靠性

SOP‑8_150MIL 封装方便自动贴片与手工焊接,适合批量生产与样机验证。器件宽温特性(-40 ℃ ~ +150 ℃)表明其经过针对高温可靠性的设计与测试,适用于对长期稳定性与耐高温有严格要求的应用场景。建议在选型时参考厂商的详细热阻、机械应力与焊接工艺规范以确保可靠性。

七 选型理由与注意事项

SIT1042T/3 适合需要在高温或恶劣环境中运行、同时要求 CAN‑FD 高速通信与低待机功耗的设计方案。选型时需关注系统总体功耗预算、总线拓扑及瞬态保护需求;若需更高速率或额外功能(例如隔离、低比特率兼容增强等),可与器件手册或厂方技术支持进一步确认具体特性与替代方案。

如需器件引脚图、时序图、电气特性曲线或 PCB 参考设计,可提供该型号的数据手册以便进行更详细的电路设计与可靠性评估。

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