Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SIT SIT488EESA
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SIT SIT488EESA
- Type
- SIT
- Minimum package
- 2500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SIT
- Electronic Component
- SIT488EESA
- Electronic Component
- 1
- Package
- SO-8
- Type
- Transceiver
- Electronic Component
- RS-485 / RS-422IC
- Electronic Component
- 0.06g
- Electronic Component
- 256
- Electronic Component
- 1
- Features
- Electronic Component
- Electronic Component
- BM0258808602
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 4.5V~5.5V
- Receiver
- 1
- Data
- 1Mbps
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SIT488EESA 产品概述
一、产品简介
SIT488EESA 是芯力特（SIT）推出的一款通用收发器，集成 1 路驱动器和 1 路接收器，支持全双工通信。器件工作电压范围为 4.5V 至 5.5V，数据速率可达 1 Mbps，适合需要稳定差分通信与多节点连接的嵌入式系统与工业控制场景。封装为常用的 SO-8，便于贴片装配与批量生产。
二、主要性能亮点
- 电源范围宽：4.5V ~ 5.5V，兼容常见 5V 系统电源。
- 低静态电流：静态电流仅 250 μA，有利于降低待机功耗。
- 通信能力强：支持 1 Mbps 数据速率和全双工通信，满足中高速串行链路需求。
- 多节点支持：设计支持多达 256 节点的网络拓扑，适用于大规模分布式系统。
- 抗静电性好：器件带有 ±15 kV 的静电放电（ESD）保护能力，提高现场可靠性。
- 工作温度范围宽：-40℃ 至 +85℃，适应工业环境温度要求。
三、典型应用场景
- 工业自动化与现场总线节点通信。
- 楼宇自控、照明与能量管理系统。
- 分布式传感与采集网络。
- 串行链路扩展、远端设备通信与数据集中器接口。
- 需要低功耗待机与稳定差分通信的嵌入式产品。
四、设计与使用注意事项
- 布局建议：VCC 端靠近器件放置旁路电容（建议 0.1 μF 与 1 μF 并联）以抑制电源干扰；差分对走线应保持长度匹配并避免与高频信号平行布线。
- 终端与偏置：在长线或多节点网络中，应在总线两端使用适当阻值的终端电阻，并根据系统选择合适的偏置（fail-safe）电路以避免空闲总线漂移。
- ESD 与浪涌防护：尽管器件本身具备 ±15 kV ESD 等级，外部仍建议在易受干扰的接入端增加瞬态抑制器件以提升抗扰能力。
- 工作环境：在高温或强振环境下，应关注焊接工艺与封装散热，必要时评估热循环可靠性。
五、封装与可靠性
SIT488EESA 提供 SO-8 封装，适配常见贴片工艺和自动化生产线。器件在 -40℃ 至 +85℃ 工业温度范围内稳定工作，配合合理的 PCB 设计与外围防护，可在苛刻环境下长期可靠运行。
综上所述，SIT488EESA 是一款面向多节点差分通信、低功耗与高可靠性需求的通用收发器，适用于工业与嵌入式系统的串行链路设计。若需进一步的电气参数、引脚功能表或参考设计，请提供具体需求，以便给出更详细的设计建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
