Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
SIT SIT2515T-I/SO SIT2515T
Configuration
1 options
Configuration
Option 165923
Availability on request
Technical data
Product details
19
specifications
Core information
- Product name
- SIT SIT2515T-I / SO
- Type
- SIT
- Minimum package
- 1500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SIT
- Electronic Component
- SIT2515T-I/SO
- Electronic Component
- 1
- Package
- SOP-18-300mil
- Type
- CANController
- Electronic Component
- CAN Transceiver
- Electronic Component
- 0.933g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Low Power; SPIInterface
- Electronic Component
- BM0258808610
- Operating Temperature
- 40℃~+85℃
- Operating Voltage
- 4.5V~5.5V
- Operating Current
- 10mA
- Data
- 1Mbps
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SIT2515T-I/SO 产品概述
一、产品简介
SIT2515T-I/SO 是芯力特（SIT）推出的一款工业级 CAN 控制器，适用于车载及工业总线通信场景。器件工作在标准 CAN 协议速率范围内，最高支持 1 Mbps 数据传输，面向需要稳定、低功耗和宽温度范围的嵌入式系统设计。器件采用 SOP-18-300mil 封装，便于中小批量的 PCB 集成与生产组装。
二、主要技术参数
- 类型：CAN 控制器
- 数据速率：1 Mbps（最高）
- 工作电压：4.5 V ~ 5.5 V
- 工作电流：典型 10 mA（工作态）
- 静态电流：典型 1 μA（待机或休眠态）
- 工作温度：-40℃ ~ +85℃（工业级）
- 封装：SOP-18-300mil
- 品牌：SIT（芯力特）
- 型号：SIT2515T-I/SO
三、主要特性与优势
- 宽工作电压范围（4.5–5.5 V），兼容常见 5 V 嵌入式系统电源。
- 支持 1 Mbps 高速传输，满足工业实时控制与车辆网络的带宽需求。
- 极低静态电流（1 μA），适合对待机功耗敏感的电源受限应用。
- 工业级温度等级（-40℃ 至 +85℃），在严苛环境下仍能保持稳定通信。
- SOP-18 小间距封装，便于波峰/回流焊装配与空间有限的 PCB 布局。
四、典型应用场景
- 汽车局域网络（车身控制、车载诊断总线）
- 工业自动化现场总线（PLC、传感器网络）
- 建筑自动化与楼宇控制系统
- 医疗设备内部数据通信（需符合相应安全标准时请另外确认）
- 其他需要可靠 CAN 总线控制的嵌入式系统
五、电路使用建议
- SIT2515T-I/SO 为 CAN 控制器级别器件，通常与 CAN 收发器（如符合 ISO 11898 的物理层器件）配合使用。
- 在 VCC 引脚附近放置 0.1 μF 陶瓷去耦电容，并尽量靠近电源引脚布局，以抑制瞬态噪声。
- CAN 总线两端应配置 120 Ω 终端电阻，必要时增加共模电感或 TVS 二极管做浪涌/ESD 保护。
- PCB 布局时尽量缩短 CAN 信号线与收发器之间的连线，避免信号回路环路增大造成干扰。
六、可靠性与注意事项
- 请根据数据手册严格遵循器件的电压与温度限制，避免长时间超出额定参数运行。
- 在高电磁干扰环境下，建议增加滤波与屏蔽措施，必要时使用差分对布线和屏蔽层。
- 焊接工艺应控制回流曲线，参考 SOP-18 类封装的焊接规范，避免过高峰值温度对器件造成应力。
七、封装与订购信息
- 标准型号：SIT2515T-I/SO
- 封装形式：SOP-18-300mil，适配常见 18 引脚 DIP/SOP PCB 布局。
- 适用于中小批量生产与手工调试。大量采购请与供应商确认交期与批次一致性。
如需更详细的电气性能曲线、引脚定义、时序图或参考电路，请提供数据手册需求或联系供应商获取 SIT2515T-I/SO 的完整规格说明书。
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Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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