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SILAN SFR25U20PN
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SILAN SFR25U20PN
- Type
- SILAN
- Minimum package
- 600 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SILAN
- Electronic Component
- SFR25U20PN
- Electronic Component
- 1
- Package
- TO-3PN
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 7.27g
- Electronic Component
- 1
- Electronic Component
- BM0231143401
- Current
- 12.5A
- Diode
- 1
- Current(Ir)
- 5uA@200V
- (Vf)
- 980mV@12A
- Electronic Component
- 40℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 600
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SFR25U20PN 产品概述
一、产品简介
SFR25U20PN 是士兰微（SILAN）推出的一款快恢复、高效率的功率二极管器件，采用1对共阴极结构并封装于TO-3PN。器件针对开关电源和功率整流场合优化，兼顾低正向压降与较短的反向恢复时间，适合高频开关和大电流整流应用。
二、主要规格
- 二极管配置：1对共阴极（双二极管，共阴）
- 正向压降（Vf）：0.98 V @ 12 A
- 额定整流电流：12.5 A（直流整流）
- 反向耐压（Vr）：200 V
- 反向电流（Ir）：5 µA @ 200 V
- 反向恢复时间（Trr）：20 ns
- 工作结温范围：-40 ℃ ~ +150 ℃
- 封装：TO-3PN
三、关键性能特点
SFR25U20PN 在12 A 工作点具备低于1 V 的正向压降，能有效降低导通损耗；20 ns 的反向恢复时间属于快恢复等级，可在开关频率较高的电源中减少开关损耗与电磁干扰；低反向漏电流（5 µA @200 V）有利于提高整机待机效率和降低温升。TO-3PN 封装提供良好热性能与机械强度，便于散热处理。
四、典型应用
- 开关电源（SMPS）输出或整流桥
- 功率因数校正（PFC）电路中的整流元件
- 电机驱动的自由轮二极管或再生回路
- 逆变器、焊机和灯具电子镇流器等高频整流场景
- 大电流充电/整流模块
五、封装与散热设计要点
TO-3PN 封装有利于将耗散热量直接传导至散热片或机箱，建议在高电流应用中采用良好接触的散热方案。以12 A、Vf≈0.98 V 计算，单颗二极管约承受≈11.8 W 的瞬时功耗，实际热设计应考虑脉冲与占空比、环境温度和回流散热路径。必要时使用绝缘垫圈或复合散热结构，并留出足够铜箔面积以降低结—壳、壳—环境温升。
六、使用与电路注意事项
- 反向恢复期间产生瞬态电压和电流，需要在高 dI/dt 场合加吸收电路（RC 吸收、RCD 钳位或共模抑制）以抑制过冲与振铃。
- 并联使用时注意电流分配，避免因正向压降差异造成不均流；必要时采用电阻均流或匹配元件。
- 高温下应进行电流降额（参考厂方热阻与温度特性曲线），保持结温低于150 ℃。
- 布局上应尽量缩短开关环路并布局稳定接地，减小寄生电感对恢复过程的影响。
- 焊接与回流需遵循封装热冲击规范，避免超温或长时间加热损伤器件。
七、可靠性与选型建议
SFR25U20PN 适用于要求中高开关频率且需兼顾效率与热管理的功率场合。选型时请参考士兰微正式 Datasheet 获取详细的热阻、波形测试条件与典型特性曲线，并依据实际工作波形评估开关损耗与热寿命。如需更低正向压降或更紧凑封装，可在同类产品中比较 Vf、Trr 与封装散热能力，以满足系统性能与成本平衡。
以上为 SFR25U20PN 的概述与工程应用建议。如需进一步的参数曲线、热阻数据或参考电路图，可参阅厂商规格书或联系供应商获取样片与测试资料。
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