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SILAN SFR60F30AEPS
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SILAN SFR60F30AEPS
- Type
- SILAN
- Minimum package
- 600 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SILAN
- Electronic Component
- SFR60F30AEPS
- Electronic Component
- 1
- Package
- TO-247
- Electronic Component
- Fast Recovery / High-Efficiency Diode
- Electronic Component
- 5.69g
- Electronic Component
- 1
- Electronic Component
- BM0258715518
- Current
- 60A
- Diode
- 1
- Current(Ir)
- 2.5uA
- (Vf)
- 1.25V@30A
- Electronic Component
- 55℃~+150℃
- Electronic Component
- Electronic Component
- Electronic Component
- 600
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SFR60F30AEPS 产品概述
一、产品简介
SFR60F30AEPS 是士兰微（SILAN）推出的快恢复整流二极管，采用 TO‑247 封装，面向高功率开关电源与工业电力电子应用。器件为一对共阴极（二个二极管共用阴极端），结合较低的正向压降与快速的反向恢复特性，可有效降低导通与开关损耗，提升系统效率与热稳定性。
二、主要特点
- 额定整流电流高，适合大电流整流场合。
- 正向压降低：Vf = 1.25 V @ 30 A，可减少导通功耗。
- 反向耐压高：Vr = 300 V，适用于中高压拓扑。
- 反向漏电流小：Ir = 2.5 μA（典型条件），有利于低待机损耗设计。
- 工作结温范围宽：-55 ℃ ~ +150 ℃，适应恶劣环境与高温运行。
- TO‑247 蜂巢式散热面易于外加散热器或直接螺栓安装，便于热管理。
三、电气参数（关键项）
- 二极管配置：1 对共阴极
- 正向压降：Vf = 1.25 V @ If = 30 A
- 直流反向耐压（Vr）：300 V
- 整流电流：60 A（额定整流电流）
- 反向电流（Ir）：2.5 μA（典型或在指定 Vr/温度下）
- 工作结温：-55 ℃ ~ +150 ℃
注：更多动态指标（反向恢复时间、峰值浪涌电流、结‑壳热阻等）请参考厂家规格书以获得完整参数。
四、封装与引脚
器件采用 TO‑247 封装，具有良好的散热与机械强度，适合螺栓安装于散热器或结构件上。具体引脚定义、散热片连接方式及外形尺寸请以厂方数据手册为准，设计时需留意隔离与螺栓扭矩等机械要求。
五、热管理与可靠性
由于工作电流与功耗较大，推荐在设计中采取以下热管理措施：短化导线路径、采用低热阻散热器、在管脚与散热背面使用导热胶或绝缘导热垫片（如需电气隔离）、并为器件留出充分的对流空间。器件允许在高结温下工作，但为延长寿命与保证性能，系统设计应使器件在持续载流时保持较低的结温。
六、典型应用
- 开关电源（SMPS）输出整流与中高压整流
- 功率因数校正（PFC）级整流器
- 逆变器与太阳能微网电路中的整流/钳位路径
- 伺服与变频驱动中的自由轮回流二极管
- 不间断电源（UPS）、电池充放电管理与工业电源模块
七、设计与使用建议
- 推荐在布局时将二极管尽量靠近热量源与电流回路，减小环路电感与纹波电压。
- 在高速开关应用中，配合合适的RC缓冲或吸收网络以抑制尖峰应力，保护二极管免受瞬态过压。
- 对于需要电气隔离的安装，使用绝缘垫并注意导热性能以兼顾散热与安全。
- 采样或测试时遵循厂方推荐的测试条件，以获得可重复的特性数据。
结语：SFR60F30AEPS 将低正向压降、高耐压与宽温域结合在 TO‑247 实用封装中，适合各种中高功率、要求高效率与可靠性的电源与驱动系统。欲获取完整特性曲线、引脚图与典型电路，请查阅士兰微官方数据手册。
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