WMSIC Electronic Components

SILAN SDM30G60FC

ModelSDM30G60FC
PackageDIP-24HL
BrandSILAN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SILAN SDM30G60FC
Type
SILAN
Minimum package
12 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SILAN
Electronic Component
SDM30G60FC
Electronic Component
1
Package
DIP-24HL
Type
IGBT
Electronic Component
Intelligent Power Module (IPM)
Electronic Component
Electronic Component
Electronic Component
9g
Electronic Component
1
Electronic Component
BM0258867704
Operating Temperature
40℃~+150℃
Operating Voltage
13.5V~16.5V
Switching Frequency
20kHz
Power Dissipation(Pd)
89W
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SDM30G60FC 产品概述

一、产品简介

SDM30G60FC 是士兰微(SILAN)推出的三相桥电机驱动芯片,基于高压IGBT器件构建,封装为 DIP-24HL。器件面向中小功率电机驱动与逆变应用,兼顾高耐压与保护功能,适用于需要高可靠性和工业级工作温度范围的场合。

二、主要规格参数

  • 类型:IGBT(集成三相桥)
  • 配置:三相桥输出
  • 耐压:600 V
  • 连续电流:30 A
  • 工作供电/偏置:13.5 V ~ 16.5 V
  • 高侧偏置电压(Vbs):13.5 V ~ 18.5 V
  • 开关频率:20 kHz(典型)
  • 隔离强度:1500 Vrms
  • 耗散功率(Pd):89 W
  • 工作温度:-40 ℃ ~ +150 ℃

三、功能特性

  • 过流保护:可检测并限制过流,保障器件及负载安全。
  • 欠压锁定(带迟滞):当偏置电压不足时自动锁定,以防误驱动;带迟滞以避免抖动。
  • 短路保护:快速响应短路事件,降低损坏风险。 这些保护机制使器件在复杂工况下具有更高的鲁棒性,便于在工业和家电电机控制场景中使用。

四、典型应用

  • 风机、压缩机与家电三相电机驱动
  • 空调与热泵压缩机控制
  • 工业变频器与伺服驱动(中低频)
  • 不间断电源(UPS)和逆变器系统

五、设计与使用建议

  • 热管理:Pd 达 89 W,实际应用中需根据PCB散热、散热片与环境温度计算结壳温度,必要时追加散热板或风冷。
  • 驱动与偏置:高侧偏置和低侧偏置需稳定,保持在推荐范围(13.5–16.5V / 13.5–18.5V)以确保UVLO与保护电路工作正常。建议在偏置端加固态滤波与退耦电容。
  • 开关性能:20 kHz 为典型工作频率;如提高频率,应关注开关损耗与电磁干扰(EMI)。可通过外接栅极电阻和RC缓冲网络调节开关斜率,平衡效率与电压应力。
  • 保护联动:合理选择电流检测元件(分流器或霍尔)与触发门槛,以配合芯片内部过流/短路保护。配置适当的死区时间以避免高低侧交叉导通。
  • 布局要点:尽量缩短高电流回路、同相电容与器件之间的走线,减小寄生电感;保持控制地与功率地分离并在单点汇流。

六、封装与可靠性

DIP-24HL 封装利于手工焊接与快速样板测试,但在高电流与高散热场合需谨慎评估焊盘散热与外加散热措施。器件工作温度覆盖 -40 ~ +150 ℃,适应工业级环境;1500 Vrms 隔离能力也为高低压侧隔离设计提供保障。

总结:SDM30G60FC 以600V耐压与30A连续电流为基础,集成多重保护,适合中小功率三相电机驱动场景。设计时重视热管理、偏置稳定与PCB功率回路布局,可获得稳定可靠的驱动性能。若需更详细的引脚定义、阻抗或推荐外围元件,请参考士兰微官方datasheet。

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