WMSIC Electronic Components

STE S07F1E222MN0B0S0N0

ModelS07F1E222MN0B0S0N0
PackageThrough-hole, P=7.5mm
BrandSTE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
STE S07F1E222MN0B0S0N0
Type
STE
Minimum package
1000 托盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
STE
Electronic Component
S07F1E222MN0B0S0N0
Electronic Component
1
Electronic Component
2.2nF
Package
Through-hole, P=7.5mm
Electronic Component
Through-hole Capacitor
Electronic Component
±20%
Electronic Component
0.48g
Pitch
7.5mm
Electronic Component
1
Electronic Component
BM0203521038
Electronic Component
Y5V
Voltage
3kV
Capacitor
3.5mm
Capacitor
7mm

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:S07F1E222MN0B0S0N0 直插瓷片电容

一、产品概述

S07F1E222MN0B0S0N0是一款由松田(STE)品牌制造的高性能直插瓷片电容。这款电容设计用于各种电子设备中,以提供稳定的电容性能和高压耐受性。其额定电压为3kV,容量为2.2nF,具有±20%的容差,适合多种应用场合,包括但不限于电源电路、滤波器和信号处理电路。

二、基本特性

  1. 电压额定值:
    S07F1E222MN0B0S0N0的额定电压为3kV(3000V),这使其能够在高电压环境下安全工作,同时也能抵御电压峰值对其性能的影响。该电压等级对于一些高压设备和工业应用至关重要。

  2. 容量与容差:
    该电容的标称电容量为2.2nF,适用于高速信号和高频应用。其±20%的容差表明该电容的实际电容量可能略有浮动,提供了一定的灵活性来适应不同电路的需求。

  3. 封装类型与引脚间距:
    S07F1E222MN0B0S0N0采用径向引线的封装方式,引脚间距为7.5mm(P=7.5mm),便于在PCB(印刷电路板)上进行插装,确保了良好的电气连接和机械支撑。

三、应用领域

S07F1E222MN0B0S0N0适合多种电子应用,尤其是在以下领域表现出色:

  1. 电源管理:
    电源转换器和开关电源等设备需要具有高电压承受能力的电容来滤波和稳定输出电压。S07F1E222MN0B0S0N0在这一领域的应用能够有效抑制电源噪音,并提高整体电源效率。

  2. 高频电路:
    由于其较小的电容量,S07F1E222MN0B0S0N0常用于高频信号线路中的耦合和去耦。这对于无线通信、广播和数字电路尤为重要。

  3. 信号处理:
    在音频和视频设备中,该电容可用于信号的耦合和解耦,以防止高频噪声的影响,从而确保信号的质量。

四、产品优势

  1. 高耐压性能:
    该电容具有优异的耐压性能,能够安全抵御高电压环境中的电气冲击,这对于延长设备的使用寿命和提高可靠性至关重要。

  2. 稳定性与可靠性:
    作为瓷片电容,S07F1E222MN0B0S0N0在温度变化和电压波动下仍能保持出色的电性能,适合永久性和高温应用。

  3. 适应性强:
    其合理的封装尺寸和引脚间距使其能适应大多数PCB设计,便于集成和替换。

五、总结

S07F1E222MN0B0S0N0直插瓷片电容是一款具备高耐压、良好稳定性和广泛适用性的电子元器件。无论是在高频信号处理还是在电源管理系统中,均能够发挥其独特的优势,提升电路设计的性能和可靠性。随着电子技术的不断进步,S07F1E222MN0B0S0N0电容将在未来的各种应用场景中继续发挥重要作用。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.