WMSIC Electronic Components

PC817X4CSP9F

ModelPC817X4CSP9F
PackageSMD
BrandSHARP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHARP PC817X4CSP9F
Type
SHARP
Minimum package
2000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHARP
Electronic Component
PC817X4CSP9F
Electronic Component
1
Package
SMD
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.412g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0000000644
Operating Temperature
30℃~+100℃
Load Voltage
80V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PC817X4CSP9F 产品概述

一、基本信息

PC817X4CSP9F 是一款由夏普(SHARP)公司制造的光耦合器,属于光电三极管系列。其具有出色的电气性能和可靠的工作特性,深受电子设计工程师的青睐,广泛应用于各类电子产品中,特别是在需要信号隔离的设计中。

  • 描述: 晶体管输出光耦,DC光电三极管
  • 输出电流: 50mA
  • 工作电压: 1.2V(典型)
  • 封装类型: SMD(表面贴装设备)
  • 引脚数量: 4P(四引脚)

二、工作原理

PC817X4CSP9F 工作原理基于光电效应。其内部结构由发光二极管(LED)和光电晶体管组成。发光二极管接收到电流信号后,发出光,而光电晶体管则接收这束光并转化为电信号。这种结构有效实现了输入与输出之间的电气隔离,避免了高电压或大电流对敏感电路的影响。

三、特性和优点

  • 高电气隔离: PC817X4CSP9F 提供优良的电气隔离,有助于保护下游电路免受干扰和高电压的损害,这在医疗设备和工业控制系统中尤为重要。

  • 适应性强: 此光耦合器可在不同的工作条件下稳定工作,包括变化的环境温度和电压波动。

  • 低输入驱动电流: 由于其内部结构,PC817X4CSP9F 确保了输入端只需要很小的驱动电流便可正常工作,使得电源管理变得更加高效。

  • 高输出电流: 该器件能够提供高达50mA的输出电流,适用于驱动负载或其他下游电路。

  • 小巧封装: SMD 封装降低了空间占用,使其适合于高密度的电路板设计,特别是在便携式设备和小型电子产品中。

四、应用领域

PC817X4CSP9F 的应用场合涵盖了多个领域:

  1. 工业自动化: 在PLC、传感器和执行器之间实现信号隔离和传输。

  2. 消费电子: 用于安全开关、遥控装置和家电中,同样起到信号隔离的作用。

  3. 网络通讯: 在网络接口和相关控制电路中,用于数据线的电气隔离,以防止电流反馈。

  4. 汽车电子: 在汽车控制单元中,对敏感电路进行保护,防止电气干扰。

五、产品规格

在选择和使用 PC817X4CSP9F 时,需要了解其具体的产品规格,例如:

  • 工作温度范围: 通常在 -40°C 到 +85°C 的范围内。
  • 输入直流电流: 需严格按照厂家推荐的参数进行操作,以确保最佳性能。
  • 绝缘强度: 保证在恶劣工作环境下的安全性和稳定性。
  • 响应时间: 适合需要高速信号传输应用的设计。

六、总结

总的来说,PC817X4CSP9F 是一种高性能、高可靠性的光耦合器,广泛适用于信号隔离和数据传输的多种电子应用中。它凭借出色的电气性能、灵活的应用特性以及小巧的封装设计,正成为现代电子设计不可或缺的重要元器件之一。在产品设计和开发过程中,充分理解其参数特性及应用场合,将有助于为项目提供更高的安全性和稳定性。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.