WMSIC Electronic Components

GP1S196HCZ0F

ModelGP1S196HCZ0F
PackageThrough Hole
BrandSHARP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHARP GP1S196HCZ0F
Type
SHARP
Minimum package
5000 管

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHARP
Electronic Component
GP1S196HCZ0F
Electronic Component
1
Electronic Component
2mm
Package
Through Hole
Electronic Component
1.1mm
Electronic Component
Photoelectric Switch(Phototransistor Output)
Electronic Component
0.084g
Electronic Component
3.1mm
Electronic Component
2.7mm
Electronic Component
0.3mm
Electronic Component
1
Electronic Component
BM69418312
(tr)
50us
(tf)
50us

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

GP1S196HCZ0F 产品概述

产品简介

GP1S196HCZ0F 是由知名电子元器件制造商夏普(SHARP)推出的一款光学传感器。该传感器采用光电晶体管技术,具有极高的灵敏度和可靠性,广泛应用于各种电子设备和自动化控制系统中。其穿透光束的直径为 0.043 英寸(约 1.1 毫米),适合 PCB 安装,从而方便集成到不同的电路板设计中。

主要特性

  1. 穿透光束尺寸:GP1S196HCZ0F 的光束直径为 0.043 英寸(1.1mm),这使得它在需要小型化和高密度集成的应用中表现尤为突出。

  2. 光电晶体管技术:采用高性能的光电晶体管,能够在各种环境条件下保持良好的工作稳定性和高灵敏度,确保传感器能够精准地探测光信号的变化。

  3. PCB 安装设计:该传感器采用 Through Hole 设计,方便在标准的印刷电路板(PCB)上安装。其通过孔的设计使得在进行电路板时的机械固定更为牢靠,同时保持良好的导电性和信号传输稳定性。

  4. 品牌信誉:作为知名品牌,夏普在光学传感器领域积累了丰富的经验,其产品在全球范围内享有较高的市场认可度和用户口碑。

应用领域

GP1S196HCZ0F 广泛应用于多种场景,包括但不限于:

  • 消费电子:用于电视、音响等家用电器中的光感测系统,提升用户交互体验。

  • 工业自动化:在生产线的自动故障检测、物体识别及计数等方面发挥重要作用,助力智能制造和自动化管理。

  • 安防系统:在安防监控设备中,作为光传感器帮助实现更高效的安全检测,提高入侵警报的反应速度。

  • 医疗设备:可应用于医用监测和诊断设备中,实现高精度的光信号检测,为疾病监测提供数据支持。

性能参数

  • 工作电压范围:确保传感器在低电压环境下正常运行,符合现代节能设计的需要。
  • 响应速度:响应时间短,适合实时监控和快速反馈的应用场景。
  • 温度范围:可靠的工作温度范围使其能适应不同的应用环境,提高了元件的适用性和稳定性。

设计注意事项

在使用 GP1S196HCZ0F 时,需要注意以下几点:

  • 正确的安装方式:因其基于 Through Hole 的设计,确保在 PCB 制作时合理布局,为传感器提供足够的安装空间,并避免短路风险。

  • 光源的选择:尽管该传感器支持多种光源,但为了获取最佳性能,建议使用与传感器规格相匹配的光源。

  • 环境光的影响:在一些高照度环境中,可能会对传感器的精度产生一定影响。在设计中应考虑这一点,并采取适当的滤光措施。

结论

GP1S196HCZ0F 是一款功能强大且应用广泛的光学传感器,凭借其高灵敏度、小型化设计及可靠的性能,在各类电子设备中都有着举足轻重的作用。无论是在消费电子、工业自动化还是医疗设备等行业中,它都能为客户提供优秀的解决方案。随着技术的持续发展,其市场前景和应用潜力更加广阔。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.