WMSIC Electronic Components

PC851XNNIP9F

ModelPC851XNNIP9F
PackageSOP-4
BrandSHARP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
SHARP PC851XNNIP9F
Type
SHARP
Minimum package
2000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
SHARP
Electronic Component
PC851XNNIP9F
Electronic Component
1
Package
SOP-4
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.414g
Electronic Component
1
Electronic Component
5us
Electronic Component
BM0225960296
Operating Temperature
25℃~+100℃
Load Voltage
350V
Type
DC
Output Current
50mA
Output Type
Photoelectric Transistor
(Pd)
200mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PC851XNNIP9F 产品概述

PC851XNNIP9F 是 SHARP(夏普)推出的一款单通道晶体管输出光电耦合器,采用 SOP-4 封装,适用于需要电气隔离与信号传输的场合。该器件以高隔离电压、较大的输出承载能力和宽温度范围为特点,适合开关电源、工业控制与通信接口等应用。

一、主要特性

  • 隔离电压(Vrms):5 kV,满足高压隔离要求。
  • 输入类型:DC,正向压降 Vf ≈ 1.2 V(典型)。
  • 最大正向电流 If:50 mA,建议工作电流视应用降额使用。
  • 输出类型:光电三极管,最大输出电流可达 50 mA。
  • 电流传输比 CTR(最小):40%,在标称测试条件下保证最低耦合效率。
  • 集射极饱和电压 VCE(sat):约 300 mV(在指定测试电流条件下)。
  • 工作温度范围:-25 ℃ ~ +100 ℃。
  • 总功耗 Pd:200 mW;负载电压可达 350 V(注意输出端设计约束)。
  • 上升/下降时间 tr / tf:4 μs / 5 μs,适合中速开关和数据传输。

二、封装与引脚

  • 封装:SOP-4(小外形塑料封装),便于 PCB 布局与自动化装配。
  • 通道数:1 通道,适用于单路隔离信号需求。
  • 推荐在 PCB 设计时注意引脚间距与爬电距离,以发挥 5 kV 隔离能力并满足安全规范。

三、典型应用场景

  • 开关电源(PWM 信号隔离、反馈回路)
  • 工业控制(PLC、继电器驱动信号隔离)
  • 微控制器与高压侧接口(需要将低压控制信号安全隔离到高压侧)
  • 信号隔离与抗干扰场合

四、设计与使用要点

  • CTR 会随 If、温度及器件批次变化,设计时应留有裕量;若信号电平要求严格,建议做样测并选择合适的 If。
  • 虽然输出端允许较高的负载电压(350 V),但输出功耗(Pd=200 mW)与安全规范限制应谨慎评估;高压侧拉电阻及限流措施必不可少。
  • VCE(sat) 在不同集电极电流下会变化,保证驱动电平时需考虑饱和压降造成的电压损失与功耗。
  • 关注器件的最大 If(50 mA)与 Pd(200 mW),避免长时间高应力工作导致寿命下降。
  • PCB 布局建议:输入侧与输出侧增加接地回路的隔离,保持爬电/气隙距离,必要时加固绝缘材料。

五、可靠性与安装注意

  • 推荐参考厂商焊接温度曲线进行回流焊,避免过高温度和长时间加热。
  • 贮存与使用应避免潮湿与机械应力,遵循 ESD 防护规范。
  • 在高温或高湿环境下工作时,应进行降额设计以延长可靠性。

总结:PC851XNNIP9F 在中等速度、需要高隔离与较大输出承载的场合表现平衡,适用于电源与工业控制等多种应用。实际设计中请结合具体的 If、负载与温度条件进行取样验证与热/电评估。若需原厂数据手册以获取详细电气特性曲线与测试条件,建议向 SHARP 官方或授权经销商索取。

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