Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PC817X2NIP1B
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SHARP PC817X2NIP1B
- Type
- SHARP
- Minimum package
- 2000 管
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SHARP
- Electronic Component
- PC817X2NIP1B
- Electronic Component
- 1
- Package
- 4-SMD
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.415g
- Electronic Component
- 1
- Electronic Component
- 3us
- Electronic Component
- BM69414156
- Operating Temperature
- 30℃~+100℃
- Load Voltage
- 80V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- Output Channel Count
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
PC817X2NIP1B 产品概述
一、产品简介
PC817X2NIP1B 是一款高性能的光耦合器，由日本 SHARP（夏普）公司制造。该光耦合器广泛应用于电子电路中，实现信号的光电隔离，具有优良的电气特性和稳定性。其主要特点包括单通道输出、适用的工作电压范围、高速响应时间等，使其在工业控制、通信设备以及计算机外围设备等领域有着广泛的应用。
二、基本参数
- 通道数： 1
- 上升时间（典型值）： 4µs
- 下降时间（典型值）： 3µs
- 输入类型： DC
- 输出类型： 晶体管
- 电压 - 输出（最大值）： 80V
- 电流 - 输出/通道： 50mA
- 电压 - 正向 (Vf)（典型值）： 1.2V
- 电流 - DC 正向 (If)（最大值）： 50mA
- Vce 饱和压降（最大）： 200mV
- 工作温度范围： -30°C ~ 100°C
- 安装类型： 表面贴装型（SMD）
- 封装/外壳： 4-SMD（鸥翼形状）
- 供应商器件封装： 4-SMD
三、产品特性
高传输效率： PC817X2NIP1B 采用了光电三极管输出，能在较低的输入电流下提供良好的输出特性，确保信号的有效传输。
快速响应时间： 该型号的上升和下降时间分别为4µs和3µs，速度适应更高频率的信号传递，能够满足快速控制与反馈的应用需求。
高抗干扰能力： 由于其光电隔离的特性，能够有效隔离输入和输出电路，在高电压或噪声环境下运行时，保护下游电路的安全性。
宽工作温度范围： 适合在-30°C 到 100°C的环境下工作，使其在恶劣环境中的应用需求得以满足。
小型封装设计： 采用4-SMD封装，能够方便地进行表面贴装，适合现代电路板设计的密集布局，节省空间。
四、应用场景
工业控制： 在自动化设备、传感器接口及人机界面等领域中，PC817X2NIP1B能够作为信号隔离器保护下游的控制电路，提升系统的安全性和可靠性。
电源管理： 在开关电源、逆变器和电流监测等电源管理设备中，能够有效地传递信号并确保系统在高电压环境下的平稳运行。
通信设备： 适用于各种通信设备中的信号隔离和转换，有助于提高信号的清晰度和稳定性。
汽车电子： 作为汽车数据总线的隔离组件，确保车载电子设备在不同工作环境下的安全可靠运行。
五、总结
PC817X2NIP1B 是一款性能卓越、适用范围广泛的光耦合器。它借助其高传输效率、快速的响应时间和优良的抗干扰能力，成为了现代电子设备中的重要组成部分。SHARP（夏普）所提供的这款光耦合器在各类电子设计中表现出色，为工程师和设计师提供了强有力的支持，助力他们实现更加复杂与安全的电路设计。无论是在工业控制、通信系统还是汽车电子中，PC817X2NIP1B 都将展现出其不可替代的价值。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
