Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
PC3H7DJ0001H
Configuration
1 options
Configuration
22+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- SHARP PC3H7DJ0001H
- Type
- SHARP
- Minimum package
- 3500 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- SHARP
- Electronic Component
- PC3H7DJ0001H
- Electronic Component
- 1
- Package
- SOP-4_P1.27
- Electronic Component
- Transistor Output Optocoupler
- Electronic Component
- 0.14g
- Electronic Component
- 1
- Electronic Component
- 3us@2mA,100Ω
- Electronic Component
- BM69417095
- Operating Temperature
- 30℃~+100℃
- Load Voltage
- 80V
- Type
- DC
- Output Current
- 50mA
- Output Type
- Photoelectric Transistor
- Output Channel Count
- 1
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：PC3H7DJ0001H
1. 产品简介
PC3H7DJ0001H 是由夏普（SHARP）制造的一款光耦合器，属于晶体管输出光耦类型。这款光耦采用了封装形式为 SOP-4_P1.27，具有卷带（TR）包装，适用于自动贴片生产。这种元器件在电子电路中广泛应用，特别是在信号隔离、开关电源和控制电路中，帮助提高系统的稳定性和可靠性。
2. 主要特性
- 光电三极管输出：PC3H7DJ0001H 使用光电三极管作为输出元件，与常规的光电二极管相比，其输出特性更为稳定且电流增益高，适合快速信号传输。
- 额定电流：该产品能够支持最大输出电流为 50mA，足以满足大多数应用需求，确保在负载变化时仍能保持良好的输出稳定性。
- 低工作电压：最大工作电压为 1.2V，使其适用于低电压应用场合，有效降低功耗。
- 封装尺寸：SOP-4_P1.27 封装使得该光耦具有较小的体积，适合空间受限的电路板设计。
3. 应用领域
PC3H7DJ0001H 被广泛应用于以下领域：
- 信号隔离：光耦合器主要用于保护敏感电路免受高电压影响，确保系统的安全性。
- 开关电源（SMPS）：在开关电源中，PC3H7DJ0001H 被用作反馈和控制部分，实现电路的稳定运行。
- 工业控制：在各类工业自动化设备中，该产品常用于电机控制、传感器信号检测等。
- 医疗设备：在医疗设备中使用光耦合器，可以有效隔离高压和低压区域，保护患者安全。
- 家用电器：光耦被广泛应用于家电产品的控制部分，如洗衣机、空调等，以实现信号的隔离与控制。
4. 性能参数
- 输出电流：最大 50 mA
- 最大工作电压：1.2 V
- 封装类型：SOP-4_P1.27
- 工作温度范围：通常在 -40°C 至 +85°C 的范围内工作，符合大多数工业应用环境。
5. 选择考虑
虽然 PC3H7DJ0001H 是一款功能强大且应用广泛的光耦合器，但作为设计师或工程师，在选择此产品时仍需考虑以下因素：
- 元件状态：需注意该产品在 Digi-Key 上显示为停产状态，意味着可能需要寻找替代元件以保证后续的产品供应。
- 电气特性匹配：在使用产品前，确保其电压、电流及其它电气特性符合具体应用要求。
- 成本与供货：由于停产可能会导致市场价格波动，采购时需考虑现有的市场条件，选择合适的替代方案。
6. 总结
PC3H7DJ0001H 是一款高性能的DC光电三极管输出光耦合器，能够有效隔离并传输信号，适用于多种电子设备和工业控制应用中。尽管面临停产风险，设计师可针对该元器件的多样应用场景和优良性能特性进行综合评估，以选定适合的替代产品以保证项目顺利进行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
