WMSIC Electronic Components

PC3H4AJ0001H

ModelPC3H4AJ0001H
PackageSMD-4P
BrandSHARP
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
SHARP PC3H4AJ0001H
Type
SHARP
Unit
Electronic Component
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
SHARP
Electronic Component
PC3H4AJ0001H
Electronic Component
1
Package
SMD-4P
Electronic Component
Transistor Output Optocoupler
Electronic Component
0.075g
Electronic Component
1
Electronic Component
3us
Electronic Component
BM0257437686
Operating Temperature
30℃~+100℃
Load Voltage
80V
Type
AC,DC
Output Current
50mA
Output Type
Photoelectric Transistor

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

PC3H4AJ0001H 产品概述

PC3H4AJ0001H 是 SHARP(夏普)推出的一款光电三极管型光耦合器,采用 SMD-4P 封装,面向信号隔离与电平移位的通用场景。器件支持 AC / DC 输入驱动,内部以发光二极管(LED)耦合光电三极管作为输出,具有高隔离电压和较宽的电流传输比(CTR)范围,适用于工业控制、通信接口及电源反馈等领域。

一、主要特性

  • 输入类型:支持 AC、DC 驱动(需按应用选用合适的整流或限流电路)
  • 输出类型:光电三极管(集电极-发射极输出)
  • 隔离耐压:2.5 kVrms(输入—输出间安全隔离)
  • 最大集电极电流:50 mA,最大集电极-发射极耐压(Vce)80 V
  • 集射极饱和电压:约 0.1 V(测试条件:If=20 mA,Ic=1 mA)
  • 正向电压 Vf(LED):1.2 V(典型)
  • 正向电流 If(最大):50 mA
  • 电流传输比(CTR):最小 20%,最大/饱和值 400%(制造与工作条件下会有较大波动)
  • 开关速度:上升时间 tr ≈ 4 μs,下降时间 tf ≈ 3 μs(适用于低至中速数字信号隔离)
  • 工作温度范围:-30 ℃ ~ +100 ℃
  • 总功耗 Pd:170 mW

二、典型应用

  • MCU、FPGA 等数字电平隔离与接口保护
  • 开关电源(SMPS)输出/反馈回路隔离检测
  • PLC 与工业控制信号隔离
  • 电表、通信设备的线路隔离与故障保护
  • 交流/直流零点检测、交流电流检测(配合整流或限流网络)

三、选型与电路设计要点

  • LED 限流:使用者需根据驱动电压选择限流电阻。例:若用 5 V DC 驱动并希望 If=1 mA,则 R = (5 V − 1.2 V) / 1 mA ≈ 3.8 kΩ。若驱动为交流,应加整流与限流电路或双向驱动设计。
  • 输出负载与 CTR:输出集电极电流 Ic ≈ CTR × If。因此在最差情况下(CTR≥20%),If=1 mA 时 Ic≥0.2 mA;若器件 CTR 偏高(可达 400%),同一 If 可产生更大 Ic,但受限于最大 Ic=50 mA 与外接负载。设计时应考虑 CTR 的批次与温度漂移,建议按最小 CTR 进行最坏情况计算并增加裕量。
  • 饱和工作:若要求低 VCE(sat),可在足够的 If 下工作,但请避免长期在极限 If(如 50 mA)下运行以免加速老化或超额功耗。
  • 开关速率:tr/tf 在微秒级,适合 kHz 级别的信号;对更高速通信场景建议使用光电二极管输出或高速光耦。

四、封装与可靠性注意

  • 封装:SMD-4P,适合自动贴装与回流焊,可用于紧凑 PCB 布局。
  • 温度与功耗:工作温度 -30 ℃~+100 ℃,Pd 170 mW,需注意焊接工艺与散热,避免长期在高温高功耗下工作。
  • 安全隔离:隔离耐压 2.5 kVrms,布局时仍需保持适当爬电与间隙距离以满足系统安全规范。

五、使用建议与注意事项

  • 在需要确定可靠隔离的安全应用中,务必配合系统级隔离设计及符合当地安规的爬电距离与材料选择。
  • 设计输入电路时,考虑 CTR 波动与温漂,若需稳定输出,可增加反馈或采用恒流驱动 LED。
  • 对频繁快速切换的场合,评估开关损耗及输出侧负载动态响应,必要时使用外部上拉/下拉电阻来优化电平转换性能。
  • 避免长期在 If 的最大额定值(50 mA)下工作,以延长使用寿命。

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