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TDK NTCG103JF103FT1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK NTCG103JF103FT1
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Power
- 100mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- NTCG103JF103FT1
- Electronic Component
- 1
- Electronic Component
- 0.5mm
- Package
- 0402
- Electronic Component
- NTCThermistor Resistor
- Electronic Component
- 0.012g
- Electronic Component
- 1mm
- Electronic Component
- 10kΩ
- Electronic Component
- 0.5mm
- Electronic Component
- 1
- B
- ±1%
- Electronic Component
- BM0000285336
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
NTCG103JF103FT1 产品概述
产品介绍
NTCG103JF103FT1 是 TDK 公司推出的一款 NTC（负温度系数）热敏电阻器，主要用于温度测量和温度补偿等应用场景。此款热敏电阻器具有极高的性能和可靠性，适用于严苛的工作环境，并能够满足广泛的工业和消费电子产品的需求。
基础参数
阻值与精度：
- 常温阻值（25°C）：10KΩ，表明该热敏电阻在25°C时的电阻值为10千欧。
- 电阻精度：±1%，确保在不同的环境和生产条件下元器件性能稳定。
- 电阻容差：±1%，提供了一定范围内的容差，对于高精度需求的应用尤为重要。
B值参数：
- B 值（25°C~50°C）：3380K，表明此热敏电阻在25°C到50°C之间的温度敏感性，这一数值直接影响到其温度响应特性。
- B 值精度：±1%，对于精确温度监控至关重要。
- B25/85：3435K，表示在25°C到85°C之间的B值，这使其适应了更宽的操作温度范围。
温度范围：
- 工作温度：-40°C至125°C，这一广泛的工作温度范围使得它适用多种不同的应用环境，包括汽车电子、工业设备及家电等。
功率规格：
- 功率：最大功率为100mW，常规功率额定为1/10W，表明它在小功率电路中的良好适用性。
封装与安装：
- 封装类型：0402（即1005公制），其极小的尺寸适合空间受限的应用，支持表面贴装。
- 安装类型：表面贴装型(SMD)，便于自动化生产和组装。
应用领域
NTCG103JF103FT1 适用于多种应用，包括但不限于：
- 消费电子：在手机、平板电脑、笔记本电脑等设备中用于温度监测和控制。
- 汽车电子：用于汽车的发动机温度监测、空调温度控制等系统，在极端温度条件下依然能够表现良好。
- 工业控制：用于工业设备的温度传感器，用以确保设备在安全的工作温度范围内运行。
- 医疗设备：在医疗监测设备中作为温度传感器，确保患者的体温得到准确测量。
产品优势
可靠性高： TDK作为知名的电子元器件制造商，其产品经过严格的质量测试，已经在多个行业得到广泛应用，用户可以对其性能和稳定性充满信心。
精确度优越： 具有良好的电阻精度和B值精度，能够提供准确的温度数据，满足高标准的测量需求。
宽泛的环境适应性： 该型热敏电阻具有极宽的工作温度范围，使其可以在各种不同的环境和应用场合下进行有效的工作。
超小型封装： 0402尺寸的封装设计，便于在高密度电路板上进行安装，节省宝贵的PCB空间。
总结
NTCG103JF103FT1 NTC 热敏电阻器是一个适合多种工业和消费类电子应用的可靠选择，凭借其卓越的性能参数、优良的温度特性和超小的封装设计，将为设计师提供更大的灵活性，并帮助开发出更智能、更高效的电子设备。无论是在温度监控、补偿还是测量方面，该产品都具备了极好的适应性和应用前景，是现代电子产品中不可或缺的关键元器件之一。
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