WMSIC Electronic Components

TDK YFF15PC1C104MT000N

ModelYFF15PC1C104MT000N
PackageSMD-4P,1x0.5mm
BrandTDK
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
TDK YFF15PC1C104MT000N
Type
TDK
Unit
Electronic Component
Minimum package
10000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
TDK
Electronic Component
YFF15PC1C104MT000N
Electronic Component
1
Electronic Component
100nF
Package
SMD-4P,1x0.5mm
Electronic Component
Capacitor Filter
Electronic Component
±20%
Electronic Component
0.012g
Electronic Component
1
Electronic Component
BM0227689096
Operating Temperature
55℃~+105℃
Voltage
16V
Current
3A
Resistor(DCR)
30mΩ

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

YFF15PC1C104MT000N 产品概述

一、产品简介

YFF15PC1C104MT000N 为 TDK 系列超小型馈通电容滤波器,标称电容值 100 nF,公差 ±20%,额定电压 16 V。封装为 SMD-4P,尺寸 1.0 × 0.5 mm(常见于 0402 尺寸等级),适用于高密度 PCB 上的去耦与 EMI 馈通滤波应用。该器件工作温度范围宽(-55 ℃ 至 +105 ℃),能够在空间受限的消费电子和通信设备中提供稳定滤波性能。

二、主要电气参数(概要)

  • 容值:100 nF
  • 精度:±20%
  • 额定电压:16 V
  • 额定电流(纹波电流):3 A
  • 直流电阻(DCR):30 mΩ(典型值)
  • 工作温度:-55 ℃ ~ +105 ℃
  • 封装:SMD-4P,1.0 × 0.5 mm

三、关键特性与优势

  • 超小体积:1.0×0.5 mm 的微型封装便于高密度布板,适合移动终端、可穿戴设备及模块化电源板。
  • 高频抑制能力:用于馈通点或电源输入处,可有效衰减高频干扰,改善电源完整性(PI)和电磁兼容性(EMC)。
  • 较高纹波承载:3 A 的额定电流/纹波电流使其在开关电源输出或近芯片去耦处表现稳定。
  • 宽温性能:适应工业级温度范围,可靠性较好。

四、典型应用场景

  • 开关电源输入/输出去耦与馈通滤波
  • MCU、RF 模块、采集芯片等近端去耦
  • 移动终端、蓝牙/无线模块、电源管理模块的 EMI 抑制
  • 高频信号链路的旁路与滤波

五、选型与使用建议

  • 直流偏置与温漂:若为陶瓷介质,使用时需考虑直流偏置和温度对有效电容的影响(实际容值可能随偏置电压及温度下降),在关键场合建议进行实际测量或选用更大标称值以补偿损失。
  • 电压/温度降额:长期工作时推荐适度降额(例如在高温或强偏置下留有裕量)以延长寿命并保证滤波性能。
  • 焊接与可靠性:遵循制造商的回流焊工艺曲线,避免过度机械应力;小封装对焊接质量敏感,应保证良好焊盘和焊膏量。

六、封装与安装注意

  • 超小封装需精确贴片与可控回流,焊盘设计应参考 TDK 推荐的 PCB land pattern 以减少应力集中。
  • 储存与搬运避免潮湿与静电损伤,装配后建议进行目视与 X 射线检查以确认焊接完整。

七、总结

YFF15PC1C104MT000N 以其 100 nF/16 V 的规格、3 A 的纹波能力及 1.0×0.5 mm 的超小封装,为要求高密度布板和良好 EMI 控制的产品提供了一种平衡体积与性能的解决方案。在设计采用前,请结合系统电压偏置、温度工况及实际频谱要求进行仿真与测试,必要时参考 TDK 官方数据手册以获取更详细的电气与可靠性参数。

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