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TDK MMZ1005S102HT000
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- TDK MMZ1005S102HT000
- Type
- TDK
- Unit
- Electronic Component
- Minimum package
- 10000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- MMZ1005S102HT000
- Electronic Component
- 1
- Package
- 0402
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0254006322
- Operating Temperature
- 55℃~+125℃
- Current
- 360mA
- @Frequency
- 1kΩ@100MHz
- Resistor(DCR)
- 490mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MMZ1005S102HT000 产品概述
一、产品简介
MMZ1005S102HT000 为 TDK 生产的一款表面贴装磁珠（ferrite bead），封装尺寸为 0402（公制 1005）。该器件设计用于高频干扰抑制，属于单通道无源器件，适合在有限空间内对电源线或信号线进行 EMI 滤除。
二、主要电气参数
- 阻抗：1 kΩ @ 100 MHz
- 误差/公差：±25%
- 直流电阻（DCR）：490 mΩ
- 额定电流：360 mA（连续工作电流）
- 工作温度范围：-55 ℃ ~ +125 ℃
- 通道数：1，封装：0402
三、性能与特性
- 高频阻抗较高（100 MHz 附近 1 kΩ），对射频及高速数字开关噪声有良好抑制效果。
- 低直流电阻（约 490 mΩ），在供电滤波应用中可降低压降与功耗。
- 紧凑 0402 封装，适用于空间受限的移动终端、IoT 模块与高密度 PCB 布局。
- 宽温度范围保证在工业及汽车级环境下的稳定性。
四、典型应用
- 电源轨（VCC）高频噪声抑制与去耦
- 高速数据线与射频链路的干扰隔离
- 手机、蓝牙/Wi‑Fi 模块、无线传感器及嵌入式控制板的 EMI 管理
- 工业与车载电子的小信号滤波场合
五、布局与使用建议
- 将磁珠靠近噪声源或器件电源引脚放置以提高抑制效率。
- 与旁路电容配合使用可形成宽带滤波效果；根据频段选择合适电容值。
- 注意额定电流限制，连续电流超过 360 mA 会引起额外温升与特性漂移。
- 推荐采用回流焊工艺，遵循制造商的焊接温度曲线以避免机械应力或性能劣化。
六、可靠性与合规
- 工作温度与结构适配通用工业环境。
- 在设计中考虑温升与电流裕量，以确保长期稳定性。
- 订购前请参考 TDK 官方数据手册以获取详细热特性、频率响应曲线和可靠性试验数据。
七、包装与订购信息
通常以卷带（tape-and-reel）形式供货，适配自动贴装生产。型号：MMZ1005S102HT000（TDK），采购与更详细规格请参考 TDK 数据手册或联系授权分销商。
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