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TDK C1005X7R1C104KT000F
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
16
specifications
Core information
- Product name
- TDK C1005X7R1C104KT000F
- Type
- TDK
- Minimum package
- 10000
Technical parameters
- Electronic Component
- TDK
- Electronic Component
- C1005X7R1C104KT000F
- Electronic Component
- 1
- Electronic Component
- 100nF
- Package
- 0402
- Electronic Component
- SMD Capacitor(MLCC)
- Electronic Component
- ±10%
- Electronic Component
- 0.012g
- Electronic Component
- 1
- Electronic Component
- BM0241276938
- Electronic Component
- X7R
- Voltage
- 16V
- Electronic Component
- 10000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
C1005X7R1C104KT000F 产品概述
一、产品概要
TDK 型号 C1005X7R1C104KT000F 为贴片多层陶瓷电容（MLCC），核心参数如下：容值 100 nF（104），公差 ±10%（K），额定电压 16 V，介质材料 X7R。封装规格为 0402（公制表示为 1005，约 1.0 mm × 0.5 mm），适用于高密度 SMT 组装，常见于消费电子、便携设备与电源去耦场合。
二、主要特性与电气性能
- X7R 介质：工作温度范围 -55°C 至 +125°C，温度变化引起的电容量变化通常在 ±15% 范围内，适合对体积和容量有较高要求但对温漂要求不如 C0G/NP0 严格的应用。
- 低等效串联电阻（ESR）与低等效串联电感（ESL）：0402 小封装在高频去耦和旁路时响应快，能有效抑制高频噪声。
- 直流偏压效应：X7R 类陶瓷电容在施加直流电压时容值会有所下降，随电压增加容值降幅明显，设计时需预留裕度或选更高额定电压/更大容值以满足实际需求。
- 自谐频率高：适合在从几十 MHz 到数百 MHz 的频段内改善电源品质，但并非精密时间基准元件。
三、典型应用场景
- MCU、FPGA、电源管理芯片的旁路与去耦；
- 开关电源的输入/输出滤波与回路稳定；
- 射频前端的去耦与阻抗匹配（作为高频旁路元件）；
- 移动设备、可穿戴设备及高密度板级布线中常用的通用旁路/耦合电容。
四、封装与焊接建议
0402（1005）封装适配主流贴片贴装与回流焊工艺。为保证焊接质量与电气性能，建议遵循 TDK 提供的回流焊曲线和推荐焊盘尺寸，器件应尽量靠近被去耦引脚放置以减小回路面积。采用 tape-and-reel 包装便于自动贴装；存储与贴装过程中避免潮湿与机械应力，必要时按厂家要求进行烘干处理。
五、设计注意与选型建议
- 考虑直流偏压与温漂：若电容将长期在接近额定电压下工作，应评估工作电压下的实际容值，必要时改用更高电压等级或增加并联容量；对于精密计时与滤波电路，优先考虑 C0G/NP0 类型。
- 多档频率覆盖：为获得更宽频率范围的去耦效果，可将不同封装与不同介质的电容并联使用（如 0402 X7R 与 0201 陶瓷或电解/钽电容组合）。
- 布局规范：尽量缩短电容到器件电源脚的连接，使用单面焊盘并控制走线宽度与回流焊流程，减少热应力与机械应力集中。
六、可靠性与资料获取
TDK 品牌生产工艺成熟，器件符合常见的环保与可靠性要求（如 RoHS）。在关键或高可靠性应用（例如汽车级）选型前，请参考 TDK 官方数据手册，获取完整的容值-电压曲线、温度特性、回流焊曲线及可靠性试验数据，以确保满足系统级要求。
如需更具体的参数曲线、封装尺寸图或推荐焊盘与回流曲线，建议直接查阅 TDK 官方数据手册或联系供应商获取样品测试验证。
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