Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
TDK HHM1595A1
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- TDK HHM1595A1
- Type
- TDK
- Minimum package
- 2000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- TDK
- Electronic Component
- HHM1595A1
- Electronic Component
- 1
- Electronic Component
- 1.25mm
- Package
- 0805
- Electronic Component
- (balun)
- Electronic Component
- 0.042g
- Electronic Component
- 2mm
- Electronic Component
- 0.95mm
- Electronic Component
- 180°@±20°
- Electronic Component
- 1
- Electronic Component
- BM69415312
- Operating Temperature
- 40℃~+85℃
- Frequency
- 3GHz~8GHz
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
HHM1595A1 产品概述
一、产品背景
在现代无线通信系统中，射频（RF）信号的传输和接收质量至关重要。射频变压器作为一种重要的电子元器件，广泛应用于信号处理、通信设备以及各种射频电路中。HHM1595A1是一款由TDK公司生产的高性能RF平衡-不平衡变压器，适用于频率范围在3GHz到8GHz之间的应用，特别适合需要高效率和低损耗的各种电子设备。
二、产品特性
相位差：HHM1595A1具有180° ±20°的相位差特性，确保在平衡到不平衡的转换过程中，信号的相位稳定性，有助于减少相位失真，并提高整体系统的信号质量。
频率范围：该变压器可有效工作在3GHz至8GHz的频率范围内，满足现代通信系统对宽带频段的需求，广泛应用于Wi-Fi、蓝牙及其他高频通信设备。
回波损耗：本器件的回波损耗最小值可达到8dB，较低的回波损耗意味着信号反射损失低，从而提升发送和接收的信号强度，优化系统的整体性能。
阻抗配置：HHM1595A1提供50Ω（非平衡）和100Ω（平衡）的阻抗选择，可灵活应用于不同的电路设计，增强系统的兼容性和适用性。
插损：最高插损值为1.5dB，这意味着在通过变压器转换时，信号损失极小，有助于保持信号的完整性，尤其在高频操作时更为关键。
表面贴装型设计：采用0805封装（2012公制），该变压器设计为表面贴装型（SMD），适合现代电子元器件的紧凑型电路设计，便于自动化焊接和组装。
三、应用领域
HHM1595A1 RF平衡-不平衡变压器广泛应用于以下领域：
无线通信：用于基站、小型基站、射频前端模块等设备，以提升信号传输的效率和质量。
射频识别（RFID）：在RFID读写器及标签中，用于高效的信号耦合和解耦。
卫星通信：在卫星通信设备中，用于信号调制和解调过程中，确保信号的稳定性和传输效率。
测试与测量设备：在各种射频测试设备中，作为信号调理组件，帮助提升测量精度。
消费电子产品：如智能手机、平板电脑和其他无线设备，提供RF信号的转换与传输支持。
四、总结
总结而言，HHM1595A1 RF平衡-不平衡变压器凭借其优越的技术参数和设计规格，为高频应用需求提供了解决方案。该产品不仅具有较高的信号处理效率和低插损特点，还具备180°相位差和多种阻抗选择，使其适应广泛的应用场景。在高频通信技术快速发展的背景下，HHM1595A1将成为设计工程师和开发人员的理想选择，助力他们开发出更高性能的电子产品，推动科技进步。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
